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TPS65137ADSCR Datasheet(PDF) 3 Page - Texas Instruments |
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TPS65137ADSCR Datasheet(HTML) 3 Page - Texas Instruments |
3 / 22 page TPS65137 www.ti.com SLVS929A – MAY 2010 – REVISED OCTOBER 2012 THERMAL INFORMATION TPS65137 THERMAL METRIC(1) DSC UNITS 10 θJA Junction-to-ambient thermal resistance(2) 56.5 θJC(top) Junction-to-case(top) thermal resistance (3) 65.8 θJB Junction-to-board thermal resistance (4) 25.2 °C/W ψJT Junction-to-top characterization parameter (5) 1.0 ψJB Junction-to-board characterization parameter (6) 17.9 θJC(bottom) Junction-to-case(bottom) thermal resistance (7) 2.5 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. (2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a. (3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC- standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. (4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8. (5) The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7). (6) The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7). (7) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. Spacer RECOMMENDED OPERATING CONDITIONS (1) MIN NOM MAX UNIT VIN Input voltage range 2.3 5.5 V TA Operating ambient temperature –40 +85 °C TJ Operating junction temperature –40 +125 °C (1) Refer to application section for further information. Copyright © 2010–2012, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: TPS65137 |
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