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CAT6219-125TDGT3 Datasheet(PDF) 2 Page - ON Semiconductor |
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CAT6219-125TDGT3 Datasheet(HTML) 2 Page - ON Semiconductor |
2 / 11 page CAT6219 http://onsemi.com 2 Figure 1. Typical Application Circuit VIN BYP EN VOUT GND OFF ON 1 mF 2.3 V to 5.5 V 2.2 mF 10 nF CAT6219 Figure 2. Adjustable Output LDO CIN VIN VOUT COUT CBYP (Optional) VIN CAT6219 ADJ EN VOUT GND OFF ON 1 mF 2.3 V to 5.5 V 2.2 mF R1 R2 COUT VOUT VIN CIN VOUT + 1.24 V 1 ) R1 R2 Table 1. PIN DESCRIPTIONS Name Function VIN Supply voltage input. GND Ground reference. EN Enable input (active high); a 2.5 MW pull−down resistor is provided. BYP Optional bypass capacitor connection for noise reduction and PSRR enhancing. ADJ Adjustable input. Feedback pin connected to resistor divider. VOUT LDO Output Voltage. TAB To be connected to the ground plane on PCB Pin Function VIN is the supply pin for the LDO. A small 1 mF ceramic bypass capacitor is required between the VIN pin and ground near the device. When using longer connections to the power supply, CIN value can be increased without limit. The operating input voltage range is from 2.3 V to 5.5 V. EN is the enable control logic (active high) for the regulator output. It has a 2.5 M W pull−down resistor, which assures that if EN pin is left open, the circuit is disabled. VOUT is the LDO regulator output. A small 2.2 mF ceramic bypass capacitor is required between the VOUT pin and ground. For better transient response, its value can be increased to 4.7 mF. The capacitor should be located near the device. For the SOT23-5 package, a continuous 500 mA output current may turn-on the thermal protection. A 250 W internal shutdown switch discharges the output capacitor in the no-load condition. GND is the ground reference for the LDO. The pin must be connected to the ground plane on the PCB. BYP is the reference bypass pin. An optional 0.01 mF capacitor can be connected between BYP pin and GND to reduce the output noise and enhance the PSRR at high frequency. ADJ is the adjustable input pin for the adjustable LDO. The pin is connected to the resistor voltage divider. Table 2. ABSOLUTE MAXIMUM RATINGS Parameter Rating Unit VIN 0 to 6.5 V VEN, VOUT −0.3 to VIN + 0.3 V Junction Temperature, TJ +150 _C Power Dissipation, PD Internally Limited (Note 1) mW Storage Temperature Range, TS −65 to +150 _C Lead Temperature (soldering, 5 sec.) 260 _C ESD Rating (Human Body Model) 3 kV Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Table 3. RECOMMENDED OPERATING CONDITIONS (Note 2) Parameter Range Unit VIN 2.3 to 5.5 V VEN 0 to VIN V Junction Temperature Range, TJ −40 to +125 _C Package Thermal Resistance, θJA SOT23−5 Package Thermal Resistance, θJA TDFN−6 235 206 _C/W NOTE: Typical application circuit with external components is shown above. 1. The maximum allowable power dissipation at any TA (ambient temperature) is PDmax = (TJmax − TA)/qJA. Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the regulator will go into thermal shutdown. 2. The device is not guaranteed to work outside its operating rating. |
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