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TLV2721CDBV Datasheet(PDF) 1 Page - Texas Instruments |
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TLV2721CDBV Datasheet(HTML) 1 Page - Texas Instruments |
1 / 28 page TLV2721, TLV2721Y Advanced LinCMOS RAILTORAIL VERY LOW POWER SINGLE OPERATIONAL AMPLIFIERS SLOS197A − AUGUST1997 − REVISED MARCH 2001 1 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 D Output Swing Includes Both Supply Rails D Low Noise . . . 19 nV/√Hz Typ at f = 1 kHz D Low Input Bias Current ...1 pA Typ D Fully Specified for Single-Supply 3-V and 5-V Operation D Very Low Power ...110 µA Typ D Common-Mode Input Voltage Range Includes Negative Rail D Wide Supply Voltage Range 2.7 V to 10 V D Macromodel Included description The TLV2721 is a single low-voltage operational amplifier available in the SOT-23 package. It offers a compromise between the ac performance and output drive of the TLV2731 and the micropower TLV2711. It consumes only 150 µA (max) of supply current and is ideal for battery-powered applications. The device exhibits rail-to-rail output performance for increased dynamic range in single- or split-supply applications. The TLV2721 is fully characterized at 3 V and 5 V and is optimized for low-voltage applications. The TLV2721, exhibiting high input impedance and low noise, is excellent for small-signal conditioning for high-impedance sources, such as piezoelectric transducers. Because of the micropower dissipation levels combined with 3-V operation, these devices work well in hand-held monitoring and remote-sensing applications. In addition, the rail-to-rail output feature with single or split supplies makes this family a great choice when interfacing with analog-to-digital converters (ADCs). With a total area of 5.6mm2, the SOT-23 package only requires one third the board space of the standard 8-pin SOIC package. This ultra-small package allows designers to place single amplifiers very close to the signal source, minimizing noise pick-up from long PCB traces. AVAILABLE OPTIONS TA VIOmax AT 25°C PACKAGED DEVICES SYMBOL CHIP FORM‡ TA VIOmax AT 25°C SOT-23 (DBV)† SYMBOL FORM‡ (Y) 0 °C to 70°C 3 mV TLV2721CDBV VAKC TLV2721Y −40 °C to 85°C 3 mV TLV2721IDBV VAKI TLV2721Y † The DBV package available in tape and reel only. ‡ Chip forms are tested at TA = 25°C only. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. DBV PACKAGE (TOP VIEW) 5 4 3 1 2 IN + VDD+ OUT VDD− /GND IN− PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright 2001, Texas Instruments Incorporated Advanced LinCMOS is a trademark of Texas Instruments. |
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