CM75RX-24S datasheet(5/13 Pages) POWEREX

Part #	CM75RX-24S

Description	Six IGBT Brake NX-Series Module 75 Amperes/1200 Volts

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Manufacturer	POWEREX [Powerex Power Semiconductors]

Direct Link	http://www.pwrx.com

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CM75RX-24S

Six IGBT + Brake NX-Series Module

75 Amperes/1200 Volts

5

03/13 Rev. 5

Powerex, Inc., 173 Pavilion Lane,Youngwood, Pennsylvania 15697 (724) 925-7272 www.pwrx.com

Electrical Characteristics,

Tj = 25°C unless otherwise specified (continued)

NTC Thermistor Part

Characteristics

Symbol

Test Conditions

Min.

Typ.

Max.

Units

Zero Power Resistance

R25

TC = 25°C*4

4.85

5.00

5.15

kΩ

Deviation of Resistance

∆R/R

TC = 100°C*4, R100 = 493Ω

-7.3

—

+7.8

%

B Constant

B(25/50)

Approximate by Equation*6

—

3375

—

K

Power Dissipation

P25

TC = 25°C*4

—

10

mW

Thermal Resistance Characteristics

Thermal Resistance, Junction to Case*4

Rth(j-c)Q

Per Inverter IGBT

—

0.25

K/W

Thermal Resistance, Junction to Case*4

Rth(j-c)D

Per Inverter FWDi

—

0.40

K/W

Thermal Resistance, Junction to Case*4

Rth(j-c)Q

Per Brake IGBT

—

0.35

K/W

Thermal Resistance, Junction to Case*4

Rth(j-c)D

Per Brake ClampDi

—

0.63

K/W

Contact Thermal Resistance,

Rth(c-f)

Thermal Grease Applied,

—

15

—

K/kW

Case to Heatsink*4

Per 1 Module*7

Mechanical Characteristics

Mounting Torque

Mt

Main Terminal, M5 Screw

22

27

31

in-lb

Mounting Torque

Ms

Mounting to Heatsink, M5 Screw

22

27

31

in-lb

Creepage Distance

ds

Terminal to Terminal

10.25

—

mm

Terminal to Baseplate

12.32

—

mm

Clearance

da

Terminal to Terminal

10.28

—

mm

Terminal to Baseplate

10.85

—

mm

Weight

m

370

g

Flatness of Baseplate

ec

On Centerline X, Y*8

±0

—

±100

µm

Recommended Operating Conditons,

Ta = 25°C

DC Supply Voltage

VCC

Applied Across P-N Terminals

—

600

850

Volts

Gate-Emitter Drive Voltage

VGE(on)

Applied Across

13.5

15.0

16.5

Volts

G*P-Es*P/G*N-Es*N (* = U, V, W) Terminals

External Gate Resistance

RG

Per Switch Inverter IGBT

8.2

—

82

Ω

Per Switch Brake IGBT

13

—

130

Ω

*4 Case temperature (TC) and heatsink temperature (Ts) is measured on the surface

(mounting side) of the baseplate and the heatsink side just under the chips.

Refer to the figure to the right for chip location.

The heatsink thermal resistance should be measured just under the chips.

*6 B(25/50) = In(

R25

)/(

1

–

1

)

R50 T25

T50

R25; Resistance at Absolute Temperature T25 [K]; T25 = 25 [°C] + 273.15 = 298.15 [K]

R50; Resistance at Absolute Temperature T50 [K]; T50 = 50 [°C] + 273.15 = 323.15 [K]

*7 Typical value is measured by using thermally conductive grease of λ = 0.9 [W/(m • K)].

*8 Baseplate (mounting side) flatness measurement points (X, Y) are shown in the figure below.

– : CONCAVE

X

Y

+ : CONVEX

MOUNTING

SIDE

MOUNTING SIDE

34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13

12

35

36

1

2

3

4

11

10

9

8

7

6

5

0

18.6

20.0

21.0

27.8 26.8

28.5

29.5

35.3

36.3

LABEL SIDE

Each mark points to the center position of each chip.

Tr*P / Tr*N / TrBr (* = U/V/W): IGBT

Di*P / Di*N (* = U/V/W): FWDi

DiBr: Clamp

Th: NTC Thermistor

28.5

35.3

40.5

26.8

20.0

Di

UP

Di

VP

Di

WP

Tr

UP

Tr

VP

Tr

WP

Di

UN

Di

VN

Di

WN

Di

Br

Tr

Br

Tr

UN

Tr

VN

Tr

WN

Th

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