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CRCW0805RJNEAHP Datasheet(PDF) 5 Page - Vishay Siliconix |
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CRCW0805RJNEAHP Datasheet(HTML) 5 Page - Vishay Siliconix |
5 / 6 page CRCW-HP e3 www.vishay.com Vishay Draloric Revision: 21-Mar-13 5 Document Number: 20043 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 All tests are carried out in accordance with the following specifications: • EN 60115-1, generic specification • EN 140400, sectional specification • EN 140401-802, detail specification • IEC 60068-2, environmental test procedures Packaging of components is done in paper or blister tapes according to IEC 60286-3. TEST PROCEDURES AND REQUIREMENTS EN 60115-1 CLAUSE IEC 60068-2 TEST METHOD TEST PROCEDURE REQUIREMENTS PERMISSIBLE CHANGE ( R) STABILITY CLASS 2 OR BETTER Stability for product types: 1 to 1 M CRCW-HP e3 4.5 - Resistance - ± 0.5 %, ± 1 %, ± 5 % 4.7 - Voltage proof U = 1.4 x Uins; 60 s - 4.13 - Short time overload 2 × U max.; duration: According to style ± (0.5 % R + 0.05 ) 4.17.2 58 (Td) Solderability Solder bath method; Sn60Pb40; non-activated flux; (235 ± 5) °C; (2 ± 0.2) s Good tinning ( 95 % covered) no visible damage Solder bath method; Sn96.5Ag3Cu0.5; non-activated flux; (245 ± 5) °C; (3 ± 0.3) s Good tinning ( 95 % covered) no visible damage 4.8.4.2 - Temperature coefficient (20/- 55/20) °C and (20/125/20) °C ± 100 ppm/K, ± 200 ppm/K 4.32 21 (UU3) Shear (adhesion) RR 1608 and smaller: 9 N RR 2012 and larger: 45 N No visible damage 4.33 21 (UU1) Substrate bending Depth 2 mm; 3 times No visible damage, no open circuit in bent position ± (0.25 % R + 0.05 ) 4.19 14 (Na) Rapid change of temperature 30 min. at - 55 °C; 30 min at 125 °C 5 cycles 1000 cycles ± (0.5 % R + 0.05 ) ± (1 % R + 0.05 ) 4.23 - Dry heat - ± (2 % R + 0.1 ) 4.23.2 2 (Ba) Damp heat, cyclic 125 °C; 16 h 4.23.3 30 (Db) cold 55 °C; 90 % RH; 24 h; 1 cycle 4.23.4 1 (Aa) Low air pressure - 55 °C; 2 h 4.23.5 13 (M) - 1 kPa; (25 ± 10) °C; 1 h 4.23.6 30 (Db) Damp heat, cyclic 55 °C; 90 % RH; 24 h; 5 cycle 4.23.7 - D.C. load 4.25.1 - Endurance at 70 °C 1.5 h on; 0.5 h off; 70 °C; 1000 h 70 °C; 8000 h ± (2 % R + 0.1 ) ± (4 % R + 0.1 ) 4.18.2 58 (Td) Resistance to soldering heat Solder bath method; (260 ± 5) °C; (10 ± 1) s ± (0.5 % R + 0.05 ) 4.35 - Flammability, needle flame test IEC 60695-15-5; 10 s No burning after 30 s 4.24 78 (Cab) Damp heat, steady state (40 ± 2) °C; (93 ± 3) % RH; 56 days ± (1 % R + 0.05 ) 4.25.3 - Endurance at upper category temperature 155 °C; 1000 h ± (2 % R + 0.1 ) 4.40 - Electrostatic discharge (human body model) IEC 61340-3-1; 3 positive and 3 negative discharges; ESD voltage according to size ± (1 % R + 0.05 ) 4.29 45 (XA) Component solvent resistance Isopropyl alcohol; 50 °C; method 2 No visible damage 4.30 45 (XA) Solvent resistance of marking Isopropyl alcohol; 50 °C; method 1; toothbrush Marking legible, no visible damage 4.22 6 (Fc) Vibration, endurance by sweeping f = 10 Hz to 2000 Hz; x, y, z 1.5 mm; A 200 m/s2; 10 sweeps per axis ± (0.5 % R + 0.05 ) 4.37 - Periodic electric overload 0.1 s “ON”; 2.5 s “OFF”; 1000 cycles ± (1 % R + 0.05 ) 4.27 - Single pulse high voltage overload, 10 μs/700 μs 10 pulses ± (1 % R + 0.05 ) U 2.5 x P 70 x R = UP 70 x R = U P 70 x R U max. = U 15 x P 70 x R 2 x U max. = Û 10 x P 70 x R 2 x U max. = |
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