VR37

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Vishay BCcomponents

Revision: 17-Aug-11

4

Document Number: 28733

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

APPLICATION INFORMATION

Hot-spot temperature rise (

T) as a function of dissipated power

Temperature rise (

T) at the lead end (soldering point) as a function

of dissipated power at various lead lengths after mounting

TESTS AND REQUIREMENTS

Essentially all tests are carried out in accordance with

IEC 60115-1 specification, category LCT/UCT/56 (rated

temperature range: Lower Category Temperature, Upper

Category Temperature; damp heat, long term, 56 days).

The

tests

are

carried

out

in

accordance

with

IEC 60068-2-xx. Test method under standard atmospheric

conditions according to IEC 60068-1, 5.3.

In the Test Procedures and Requirements table the tests

and requirements are listed with reference to the relevant

clauses of IEC 60115-1 and IEC 60068-2-xx test methods.

A short description of the test procedure is also given. In

some instances deviations from the IEC recommendations

were necessary for our method of specifying.

All soldering tests are performed with mildly activated flux.

0

0.4

1.2

0

0.8

20

40

60

80

P (W)

ΔT

(K)

0

0.4

1.2

0

0.8

10

20

30

40

50

P (W)

5 mm

10 mm

15 mm

∆T

(K)

TEST PROCEDURES AND REQUIREMENTS

IEC

60115-1

CLAUSE

IEC

60068-2-

TEST

METHOD

TEST

PROCEDURE

REQUIREMENTS

4.16

Robustness of terminations:

4.16.2

21 (Ua1)

Tensile all samples

Ø 0.7 mm; load 10 N; 10 s

4.16.3

21 (Ub)

Bending half number

of samples

Ø 0.7 mm; load 5 N; 4 x 90°

4.16.4

21 (Uc)

Torsion other half

of samples

3 x 360° in opposite directions

No damage

R max.: ± (0.5 % R + 0.05 )

4.17

20 (Ta)

Solderability

2 s; 235 °C: Solder bath method; SnPb40

3 s; 245 °C: Solder bath method;

SnAg3Cu0.5

Good tinning (

 95 % covered);

no damage

Solderability

(after aging)

8 h steam or 16 h 155 °C;

leads immersed 6 mm;

for 2 s at 235 °C; solder bath (SnPb40)

for 3 s at 245 °C; solder bath

(SnAg3Cu0.5) method

Good tinning (

95 % covered);

no damage

4.18

20 (Tb)

Resistance to

soldering heat

Thermal shock: 10 s; 260 °C;

3 mm from body

R max.: ± (0.5 % R + 0.05 )

4.19

14 (Na)

Rapid change of temperature

30 min at - 55 °C and

30 min at + 155 °C; 5 cycles

R max.: ± (0.5 % R + 0.05 )

4.20

29 (Eb)

Bump

3 x 1500 bumps in 3 directions; 40 g

No damage

R max.: ± (0.5 % R + 0.05 )