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VR37000005FA100 Datasheet(PDF) 4 Page - Vishay Siliconix |
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VR37000005FA100 Datasheet(HTML) 4 Page - Vishay Siliconix |
4 / 6 page VR37 www.vishay.com Vishay BCcomponents Revision: 17-Aug-11 4 Document Number: 28733 For technical questions, contact: filmresistorsleaded@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 APPLICATION INFORMATION Hot-spot temperature rise ( T) as a function of dissipated power Temperature rise ( T) at the lead end (soldering point) as a function of dissipated power at various lead lengths after mounting TESTS AND REQUIREMENTS Essentially all tests are carried out in accordance with IEC 60115-1 specification, category LCT/UCT/56 (rated temperature range: Lower Category Temperature, Upper Category Temperature; damp heat, long term, 56 days). The tests are carried out in accordance with IEC 60068-2-xx. Test method under standard atmospheric conditions according to IEC 60068-1, 5.3. In the Test Procedures and Requirements table the tests and requirements are listed with reference to the relevant clauses of IEC 60115-1 and IEC 60068-2-xx test methods. A short description of the test procedure is also given. In some instances deviations from the IEC recommendations were necessary for our method of specifying. All soldering tests are performed with mildly activated flux. 0 0.4 1.2 0 0.8 20 40 60 80 P (W) ΔT (K) 0 0.4 1.2 0 0.8 10 20 30 40 50 P (W) 5 mm 10 mm 15 mm ∆T (K) TEST PROCEDURES AND REQUIREMENTS IEC 60115-1 CLAUSE IEC 60068-2- TEST METHOD TEST PROCEDURE REQUIREMENTS 4.16 Robustness of terminations: 4.16.2 21 (Ua1) Tensile all samples Ø 0.7 mm; load 10 N; 10 s Number of failures < 10 x 10-6 4.16.3 21 (Ub) Bending half number of samples Ø 0.7 mm; load 5 N; 4 x 90° Number of failures < 10 x 10-6 4.16.4 21 (Uc) Torsion other half of samples 3 x 360° in opposite directions No damage R max.: ± (0.5 % R + 0.05 ) 4.17 20 (Ta) Solderability 2 s; 235 °C: Solder bath method; SnPb40 3 s; 245 °C: Solder bath method; SnAg3Cu0.5 Good tinning ( 95 % covered); no damage Solderability (after aging) 8 h steam or 16 h 155 °C; leads immersed 6 mm; for 2 s at 235 °C; solder bath (SnPb40) for 3 s at 245 °C; solder bath (SnAg3Cu0.5) method Good tinning ( 95 % covered); no damage 4.18 20 (Tb) Resistance to soldering heat Thermal shock: 10 s; 260 °C; 3 mm from body R max.: ± (0.5 % R + 0.05 ) 4.19 14 (Na) Rapid change of temperature 30 min at - 55 °C and 30 min at + 155 °C; 5 cycles R max.: ± (0.5 % R + 0.05 ) 4.20 29 (Eb) Bump 3 x 1500 bumps in 3 directions; 40 g No damage R max.: ± (0.5 % R + 0.05 ) |
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