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LM2673S-3.3 Datasheet(PDF) 4 Page - Texas Instruments

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Part # LM2673S-3.3
Description  LM2673 SIMPLE SWITCHER 3A Step-Down Voltage Regulator with Adjustable Current
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

LM2673S-3.3 Datasheet(HTML) 4 Page - Texas Instruments

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LM2673
SNVS030N – APRIL 2000 – REVISED APRIL 2013
www.ti.com
All Output Voltage Versions
Electrical Characteristics
Limits appearing in bold type face apply over the entire junction temperature range of operation,
−40°C to 125°C.
Specifications appearing in normal type apply for TA = TJ = 25°C. Unless otherwise specified, RADJ = 8.2KΩ, VIN=12V for the
3.3V, 5V and Adjustable versions and VIN=24V for the 12V version.
Symbol
Parameter
Conditions
Typ
Min
Max
Units
DEVICE PARAMETERS
IQ
Quiescent Current
VFEEDBACK = 8V
4.2
6
mA
For 3.3V, 5.0V, and ADJ Versions
VFEEDBACK = 15V
For 12V Versions
VADJ
Current Limit
1.21
1.181/1.169
1.229/1.246
V
Adjust Voltage
ICL
Current Limit
RADJ = 8.2KΩ
(1)
4.5
3.8/3.6
5.25/5.4
A
IL
Output Leakage
VIN = 40V, Softstart Pin = 0V
mA
Current
VSWITCH = 0V
1.0
1.5
mA
VSWITCH = −1V
6
15
RDS(ON)
Switch On-
ISWITCH = 3A
0.15
0.17/0.29
Ω
Resistance
fO
Oscillator
Measured at Switch Pin
260
225
280
kHz
Frequency
D
Duty Cycle
Maximum Duty Cycle
91
%
Minimum Duty Cycle
0
%
IBIAS
Feedback Bias
VFEEDBACK = 1.3V
85
nA
Current
ADJ Version Only
VSFST
Softstart Threshold
0.63
0.53
0.74
V
Voltage
ISFST
Softstart Pin
Softstart Pin = 0V
3.7
6.9
μA
Current
θJA
Thermal
NDZ Package, Junction to Ambient(2)
65
Resistance
θJA
NDZ Package, Junction to Ambient(3)
45
θJC
NDZ Package, Junction to Case
2
θJA
KTW Package, Junction to Ambient(4)
56
°C/W
θJA
KTW Package, Junction to Ambient(5)
35
θJA
KTW Package, Junction to Ambient(6)
26
θJC
KTW Package, Junction to Case
2
++
θJA
NHM Package, Junction to Ambient(7)
55
°C/W
θJA
NHM Package, Junction to Ambient(8)
29
(1)
The peak switch current limit is determined by the following relationship: ICL=37,125/ RADJ.
(2)
Junction to ambient thermal resistance (no external heat sink) for the 7 lead TO-220 package mounted vertically, with ½ inch leads in a
socket, or on a PC board with minimum copper area.
(3)
Junction to ambient thermal resistance (no external heat sink) for the 7 lead TO-220 package mounted vertically, with ½ inch leads
soldered to a PC board containing approximately 4 square inches of (1 oz.) copper area surrounding the leads.
(4)
Junction to ambient thermal resistance for the 7 lead DDPAK mounted horizontally against a PC board area of 0.136 square inches (the
same size as the DDPAK package) of 1 oz. (0.0014 in. thick) copper.
(5)
Junction to ambient thermal resistance for the 7 lead DDPAK mounted horizontally against a PC board area of 0.4896 square inches
(3.6 times the area of the DDPAK package) of 1 oz. (0.0014 in. thick) copper.
(6)
Junction to ambient thermal resistance for the 7 lead DDPAK mounted horizontally against a PC board copper area of 1.0064 square
inches (7.4 times the area of the DDPAK package) of 1 oz. (0.0014 in. thick) copper. Additional copper area will reduce thermal
resistance further. See the thermal model in Switchers Made Simple® software.
(7)
Junction to ambient thermal resistance for the 14-lead VSON mounted on a PC board copper area equal to the die attach paddle.
(8)
Junction to ambient thermal resistance for the 14-lead VSON mounted on a PC board copper area using 12 vias to a second layer of
copper equal to die attach paddle. Additional copper area will reduce thermal resistance further. For layout recommendations, refer to
Application Note AN-1187 at www.ti.com/lsds/ti/analog/powermanagement/power_portal.page.
4
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Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM2673


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