Ceramic transient voltage suppressors

B72530E1140S262

SMD multilayer varistor, E series

CT1210S14BAUTOG

PPD ML PD

2012-05-04

Please read Cautions and warnings and

Page 7 of 14

Important notes at the end of this document.

Wave soldering temperature profile

Temperature characteristic at component terminal with dual-wave soldering

˚C

300

250

200

150

100

50

Time

KKE0144-J-E

2 K/s

approx. 200 K/s

5 K/s

1st wave

2nd wave

2 K/s

235 ˚C ... 260 ˚C

Forced

Limit curves

Normal curve

10 s

100 ˚C ... 130 ˚C

s

250

200

150

100

50

0

0

cooling

Soldering guidelines

The usage of mild, non-activated fluxes for soldering is recommended, as well as proper cleaning of

the PCB.

Storage condition



As far as possible, the components should be soldered within 12 months after delivery from

EPCOS.



Storage temperature: −25 up to +45 °C.



Relative humidity: <75% annual average, <95% on max. 30 days in a year.