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ADA4817-2 Datasheet(PDF) 2 Page - Analog Devices |
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ADA4817-2 Datasheet(HTML) 2 Page - Analog Devices |
2 / 28 page ADA4817-1/ADA4817-2 Data Sheet Rev. B | Page 2 of 28 TABLE OF CONTENTS Features .............................................................................................. 1 Applications....................................................................................... 1 Connection Diagrams...................................................................... 1 General Description ......................................................................... 1 Revision History ............................................................................... 2 Specifications..................................................................................... 3 ±5 V Operation............................................................................. 3 5 V Operation ............................................................................... 4 Absolute Maximum Ratings............................................................ 5 Thermal Resistance ...................................................................... 5 Maximum Safe Power Dissipation ............................................. 5 ESD Caution.................................................................................. 5 Pin Configurations and Function Descriptions ........................... 6 Typical Performance Characteristics ............................................. 8 Test Circuits..................................................................................... 13 Theory of Operation ...................................................................... 14 Closed-Loop Frequency Response........................................... 14 Noninverting Closed-Loop Frequency Response.................. 14 Inverting Closed-Loop Frequency Response ............................. 14 Wideband Operation ................................................................. 15 Driving Capacitive Loads.......................................................... 15 Thermal Considerations............................................................ 15 Power-Down Operation ............................................................ 15 Capacitive Feedback................................................................... 16 Higher Frequency Attenuation................................................. 16 Layout, Grounding, and Bypassing Considerations .................. 17 Signal Routing............................................................................. 17 Power Supply Bypassing............................................................ 17 Grounding................................................................................... 17 Exposed Paddle........................................................................... 17 Leakage Currents........................................................................ 18 Input Capacitance ...................................................................... 18 Input-to-Input/Output Coupling............................................. 18 Applications Information .............................................................. 19 Low Distortion Pinout............................................................... 19 Wideband Photodiode Preamp................................................ 19 High Speed JFET Input Instrumentation Amplifier.............. 21 Active Low-Pass Filter (LPF) .................................................... 22 Outline Dimensions....................................................................... 24 Ordering Guide .......................................................................... 25 REVISION HISTORY 5/13—Rev. A to Rev. B Changes to Figure 3.......................................................................... 1 Changes to Figure 7.......................................................................... 7 Updated Outline Dimensions....................................................... 24 Changes to Ordering Guide .......................................................... 25 3/09—Rev. 0 to Rev. A Added 8-Lead SOIC Package............................................Universal Changes to Features Section and General Description Section . 1 Changes to Table 1............................................................................ 3 Changes to Table 2............................................................................ 4 Changes to Figure 4.......................................................................... 5 Changes to Figure 9, Figure 11, and Figure 12 ............................. 8 Changes to Figure 21, Figure 22, and Figure 24 ......................... 10 Changes to Figure 33...................................................................... 12 Added Figure 34; Renumbered Sequentially .............................. 12 Changes to Thermal Considerations Section and Power-Down Operation Section........................................................................... 15 Changes to Capacitive Feedback Section and Figure 46 ........... 16 Added Higher Frequency Attenuation Section, Figure 47, Figure 48, and Figure 49; Renumbered Sequentially................. 16 Updated Outline Dimensions....................................................... 24 Changes to Ordering Guide .......................................................... 25 11/08—Revision 0: Initial Version |
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