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FODM121B Datasheet(PDF) 9 Page - Fairchild Semiconductor |
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FODM121B Datasheet(HTML) 9 Page - Fairchild Semiconductor |
9 / 10 page 9 www.fairchildsemi.com FODMX Rev. 1.0.7 Footprint Drawing for PCB Layout Recommended Infrared Reflow Soldering Profile Note: All dimensions are in mm. 0.80 6.50 2.54 1.00 • Peak reflow temperature: 260 °C (package surface temperature) • Time of temperature higher than 245 °C: 40 seconds or less • Number of reflows: 3 300 250 200 150 100 50 0 50 0 100 150 200 250 300 Time (s) 10s 260 °C 245 °C 40s |
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