High Speed Backplane Connectors

TE Connectivity

IMPACT Connectors

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Up to 25 Gb/s performance

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Density up to 32 high speed differential pairs per cm (80 DP per inch)

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100 Ohm

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Modular system: 2, 3, 4, 5, 6 pair/ column available. 6 through 20 columns

offered in increments of 2 columns

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See back panel for representative part numbers

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Order catalog 7-1773458-1, "IMPACT Backplane Connector System"

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Website: www.te.com/products/Impact

Z-PACK TinMan 100 Ohm and 85 Ohm Connectors

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Up to 12.5 Gb/s performance

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Density up to 14 high speed differential pairs per cm (80 DP per inch);

6-16 columns available

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Modular system: 3, 4, 5, and 6 pair/column, respectively fitting 16.25mm

(.625"), 20.32 mm (0.8") and 25.4 mm (1") slot-pitch

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85 ohm impedance version for QPCle and Intel QPI standards, and other

85 ohm system applications

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See back panel for representative part numbers

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Order catalog 1773095, "High Speed Backplane Connector"

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Website: http://www.te.com/ZPackTinMan

Z-PACK Slim uHD Connectors

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2 versions

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CS (Common Speed) 8 Gb/s

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HS (High Speed) 12.5 Gb/s, scalable to 20 Gb/s

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Density (in a 2 DP/Column assignment): 55 lines per cm, 141 lines per inch

(in a SE assignment)

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Low profile — 12.5 mm wide

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Flexible pin assignments

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See back panel for representative part numbers

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Order catalog 1773095, "High Speed Backplane Connector"

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Website: http://www.te.com/products/zpackuhd