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TFDU4301-TR1 Datasheet(PDF) 7 Page - Vishay Siliconix |
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TFDU4301-TR1 Datasheet(HTML) 7 Page - Vishay Siliconix |
7 / 12 page TFDU4301 Infrared Transceiver Module (SIR, 115.2 kbit/s) for IrDA® Applications Vishay Semiconductors Document Number: 81965 For technical questions within your region, please contact one of the following: irdasupportAM@vishay.com, irdasupportAP@vishay.com, irdasupportEU@vishay.com www.vishay.com Rev. 1.0, 22-Apr-10 7 RECOMMENDED SOLDER PROFILES Solder Profile for Sn/Pb Soldering Fig. 4 - Recommended Solder Profile for Sn/Pb Soldering Lead (Pb)-free, Recommended Solder Profile The TFDU4301 is a lead (Pb)-free transceiver and qualified for lead (Pb)-free processing. For lead (Pb)-free solder paste like Sn(3.0-4.0)Ag(0.5-0.9)Cu, there are two standard reflow profiles: Ramp-Soak-Spike (RSS) and Ramp-To-Spike (RTS). The Ramp-Soak-Spike profile was developed primarily for reflow ovens heated by infrared radiation. With widespread use of forced convection reflow ovens the Ramp-To-Spike profile is used increasingly. Shown below in figure 5 and 6 are VISHAY's recommended profiles for use with the TFDU4301 transceivers. For more details please refer to the application note “SMD Assembly Instructions”. A ramp-up rate less than 0.9 °C/s is not recommended. Ramp-up rates faster than 1.3 °C/s could damage an optical part because the thermal conductivity is less than compared to a standard IC. Wave Soldering For TFDUxxxx and TFBSxxxx transceiver devices wave soldering is not recommended. Manual Soldering Manual soldering is the standard method for lab use. However, for a production process it cannot be recommended because the risk of damage is highly dependent on the experience of the operator. Nevertheless, we added a chapter to the above mentioned application note, describing manual soldering and desoldering. Storage The storage and drying processes for all VISHAY transceivers (TFDUxxxx and TFBSxxx) are equivalent to MSL4. The data for the drying procedure is given on labels on the packing and also in the application note “Taping, Labeling, Storage and Packing”. Fig. 5 - Solder Profile, RSS Recommendation Fig. 6 - RTS Recommendation 0 20 40 60 80 100 120 140 160 180 200 220 240 260 0 50 100 150 200 250 300 350 Time/s 2 to 4 °C/s 2 to 4 °C/s 10 s max. at 230 °C 120 to180 s 160 °C max. 240 °C max. 90 s max. 19535 0 25 50 75 100 125 150 175 200 225 250 275 0 50 100 150 200 250 300 350 Time/s 30 s max. 2 °C/s to 3 °C/s 2 °C/s to 4 °C/s 90 s to 120 s T ≥ 217 °C for 70 s max. Tpeak = 260 °C 70 s max. T ≥ 255 °C for 10 s....30 s 19532 0 40 80 120 160 200 240 280 0 50 100 150 200 250 300 Time/s < 4 °C/s 1.3 °C/s Time above 217 °C t ≤ 70 s Time above 250 °C t ≤ 40 s Peak temperature Tpeak = 260 °C < 2 °C/s Tpeak = 260 °C max. TFDU Fig3 |
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