www.kersemi.com

2

IRFR224, IRFU224, SiHFR224, SiHFU224

Notes

a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).

d. 1.6 mm from case.

e. When mounted on 1” square PCB (FR-4 or G-10 material).

Note

a. When mounted on 1" square PCB ( FR-4 or G-10 material).

Operating Junction and Storage Temperature Range

- 55 to + 150

°C

Soldering Recommendations (Peak Temperature)

for 10 s

THERMAL RESISTANCE RATINGS

PARAMETER

SYMBOL

TYP.

MAX.

UNIT

Maximum Junction-to-Ambient

-50

°C/W

Maximum Junction-to-Ambient

-

110

Maximum Junction-to-Case

-3.0

PARAMETER

SYMBOL

LIMIT

UNIT

PARAMETER

SYMBOL

TEST CONDITIONS

MIN.

TYP.

MAX.

UNIT

Static

Drain-Source Breakdown Voltage

250

-

-

V

ΔV

-

0.36

-

V/°C

Gate-Source Threshold Voltage

2.0

-

4.0

V

Gate-Source Leakage

-

-

± 100

nA

Zero Gate Voltage Drain Current

-

-

25

µA

-

-

250

Drain-Source On-State Resistance

--

1.1

Ω

Forward Transconductance

1.5

-

-

S

Dynamic

Input Capacitance

-

260

-

pF

Output Capacitance

-77

-

Reverse Transfer Capacitance

-15

-

Total Gate Charge

--

14

nC

Gate-Source Charge

--

2.7

Gate-Drain Charge

--

7.8

Turn-On Delay Time

-7.0

-

ns

Rise Time

-13

-

Turn-Off Delay Time

-20

-

Fall Time

-12

-

Internal Drain Inductance

Between lead,

6 mm (0.25") from

package and center of

die contact

-4.5

-

nH

Internal Source Inductance

-7.5

-

D

S

G