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3SMAJ5914B Datasheet(PDF) 1 Page - Micro Commercial Components |
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3SMAJ5914B Datasheet(HTML) 1 Page - Micro Commercial Components |
1 / 4 page Terminals solderable per MIL-STD-750, Method 2026 Polarity is indicated by cathode band. Packaging: Standard 12mm Tape (see EIA 481) Maximum temperature for soldering: 260 C for 10 seconds. Maximum Ratings @ 25 oC Unless Otherwise Specified Steady State Power Dissipation Pd 3.0W Operation and Storage Temperature TJ , TSTG -55 oC to +150 oC 2. Forward Current @ 200mA. 3. Mounted on 5.0mm 2 (1oz thick) Iand areas. Lead temperature at TL=75 3SMAJ5913B THRU 3SMAJ59 MCC www.mccsemi.com DO-214A C (SM A) (LEAD FRAME) 3.0 Watt Surface Mount Silicon Zener Diodes omponents 20736 Marilla Street Chatsworth !"# $% !"# TM Micro Commercial Components Maximum Forward Voltage (Note: 3) 1 of 4 0 VF 1.5V (Note: 2) 0.070" 0.090" 0.085" SUGGESTED SOLDER PAD LAYOUT DIMENSIONS INCHES MM DIM MIN MAX MIN MAX NOTE A .079 .096 2.00 2.44 B .050 .064 1.27 1.63 C .002 .008 .05 .20 D --- .02 --- .51 E .030 .060 .76 1.52 F .065 .091 1.65 2.32 G .189 .220 4.80 5.59 H .157 .181 4.00 4.60 J .090 .115 2.25 2.92 H J E F G A B D C 3SMAJ5913B THRU 3SMAJ5956B Resistance RthJL 25 /W Thermal Junction to Lead Revision: D 20 13/04/11 Mechanical Data Features Note: 1. High Temperature Solder Exemptions Applied, see EU Directive Annex 7. o C Moisture Sensitivity Level 1 Epoxy meets UL 94 V-0 flammability rating • Halogen free available upon request by adding suffix "-HF" • 3.3thru 200 Volt Voltage Range • Low Inductance, Low Profile Mounting • Glasss Passivated Junction • High specified maximum current(IZM)when adequately heat sinking • Surface Mount Application • Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates Compliant. See ordering information) Thermal Junction to Ambient Resistance R thJA 135 /W Lead temperature at TA=15 OC |
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