2011-09-19

10

BC857...-BC860...

Package TSLP-3-1

2

3

1

0.4

+0.1

BFR193L3

Type code

Pin 1 marking

Laser marking

0.76

4

0.5

Pin 1

marking

Reel ø180 mm = 15.000 Pieces/Reel

For board assembly information please refer to Infineon website "Packages"

Package Outline

Foot Print

Marking Layout (Example)

Standard Packing

Stencil apertures

Copper

Solder mask

0.2

0.45

0.17

0.2

0.225

0.6

0.225

0.15

R0.1

1

2

±0.05

0.35

±0.035

2 x 0.15

1)

Top view

Bottom view

1) Dimension applies to plated terminal

±0.035

0.5

1)

±0.05

0.6

3

Pin 1

marking

0.05 MAX.