SOIC-16 Tape and Reel Data and Package Dimensions, continued

July 1999, Rev. B

P1

A0

D1

P0

F

W

E1

D0

E2

B0

Tc

Wc

K0

T

Dimensions are in inches and millimeters

Tape Size

Reel

Option

Dim A

Dim B

Dim C

Dim D

Dim N

Dim W1

Dim W2

Dim W3 (LSL-USL)

16mm

13" Dia

13.00

330

0.059

1.5

512 +0.020/-0.008

13 +0.5/-0.2

0.795

20.2

4.00

100

0.646 +0.078/-0.000

16.4 +2/0

0.882

22.4

0.626 – 0.764

15.9 – 19.4

13" Diameter Option

Dim A

Max

W3

W2 max Measured at Hub

W1 Measured at Hub

Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481

rotational and lateral movement requirements (see sketches A, B, and C).

10 deg maximum component rotation

0.9mm

maximum

0.9mm

maximum

Sketch C (Top View)

Component lateral movement

Typical

component

cavity

center line

10 deg maximum

Typical

component

center line

B0

A0

Sketch B (Top View)

Component Rotation

Sketch A (Side or Front Sectional View)

Component Rotation

User Direction of Feed

SOIC(16lds) Embossed Carrier Tape

Configuration: Figure 3.0

SOIC(16lds) Reel Configuration: Figure 4.0

Dimensions are in millimeter

Pkg type

A0

B0

W

D0

D1

E1

E2

F

P1

P0

K0

T

Wc

Tc

SOIC(16lds)

(16mm)

6.60

+/-0.30

10.35

+/-0.25

16.0

+/-0.3

1.55

+/-0.05

1.60

+/-0.10

1.75

+/-0.10

14.25

min

7.50

+/-0.05

8.0

+/-0.1

4.0

+/-0.1

2.40

+/-0.40

0.450

+/-0.150

13.0

+/-0.3

0.06

+/-0.02

Dim D

min

Dim C

B Min

DETAIL AA

See detail AA

Dim A

max

Dim N