NDH854P Rev.D

0

0.2

0.4

0.6

0.8

1

0

0.5

1

1.5

2

2.5

2oz COPPER MOUNTING PAD AREA (in

)

2

1c

1b

1a

4.5"x5" FR-4 Board

T

= 25 C

Still Air

A

o

Figure 15. Maximum Steady-State Drain

Current versus Copper Mounting Pad

Area.

Figure 14. SuperSOT

Power Dissipation versus Copper Mounting

Pad Area.

Typical Thermal Characteristics

0 .0001

0 .001

0 .01

0 .1

1

10

100

300

0.01

0.02

0.03

0.05

0 .1

0 .2

0 .3

0 .5

1

t , TIME (sec)

1

Single Pulse

D = 0.5

0.1

0.05

0.02

0.01

0.2

Duty Cycle, D = t

/ t

1

2

R

(t) = r(t) * R

R

= See Note 1c

θJA

θJA

θJA

T - T

= P * R

(t)

A

J

P(pk)

Figure 17. Transient Thermal Response Curve

.

Note:

Thermal characterization performed using the conditions described in note 1c. Transient thermal response will change

depending on the circuit board design.

Figure 16. Maximum Safe Operating Area.

0.1

0.2

0.5

1

2

5

10

20

30

50

0.01

0.05

0.1

0.5

1

2

5

10

30

- V

, DRAIN-SOURCE VOLTAGE (V)

RDS(ON)

LIMIT

A

DC

DS

1s

100ms

10ms

1ms

10s

V

= -10V

SINGLE PULSE

R

= See Note 1c

T

= 25°C

GS

A

100us

-20

-16

-12

-8

-4

0

0

6

12

18

24

I , DRAIN CURRENT (A)

T = -55°C

J

25°C

D

V

= - 5V

DS

125°C

Figure 13. Transconductance Variation with Drain

Current and Temperature.

0

0.2

0.4

0.6

0.8

1

2

3

4

5

6

2oz COPPER MOUNTING PAD AREA (in

)

2

1c

1b

1a

4.5"x5" FR-4 Board

T

= 25 C

Still Air

V

= -10V

A

o

GS