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ATCC-211A-006-336 Datasheet(PDF) 3 Page - Abracon Corporation

Part # ATCC-211A-006-336
Description  Meets EIA-535BAAC standard, Large capacitance in small size
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Manufacturer  ABRACON [Abracon Corporation]
Direct Link  https://abracon.com
Logo ABRACON - Abracon Corporation

ATCC-211A-006-336 Datasheet(HTML) 3 Page - Abracon Corporation

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ATCC-211(A, B, P) Series
RoHS
Compliant
30332 Esperanza, Rancho Santa Margarita, California92688
tel 949-546-8000 | fax 949-546-8001| www.abracon.com
Revised: 12.22.12
Visit www.abracon.com for Terms & Conditions of Sale
Pb
ABRACON IS
ISO9001:2008
CERTIFIED
Solid Tantalum Chip Capacitor
3.2 x 1.60 x 1.6mm
3.5 x 2.80 x 1.9mm
2.0 x 1.25 x 1.1mm
ATCC-211(A, B, P) Series
Solid Tantalum Chip Capacitor
Date of Issue: Oct. 29th, 2012
3.2 x 1.60 x 1.6mm
3.5 x 2.80 x 1.9mm
2.0 x 1.25 x 1.1mm
ESD Sensitive
Page (6) of (15)
Abracon Drawing # 603389
Revision #: Initial Release
Mechanical Dimensions
Recommended Land Pattern
Dimensions: mm
Dimension
Code
L
W
H
F(±0.10)
S(±0.30)
A
B
C
P
2.0±0.15
1.25±0.15
1.1±0.15
0.9
0.5
1.1
1.05
1.2
A
3.2±0.20
1.6±0.20
1.6±0.20
1.2
0.8
1.1
1.35
1.5
B
3.5±0.2
2.8±0.2
1.9±0.2
2.2
0.8
1.4
1.35
2.7
Recommended Land Pattern
Dimensions: mm
OUTLINE DIMENSIONS:
ATCC-211(A, B, P) Series
Solid Tantalum Chip Capacitor
Date of Issue: Oct. 29th, 2012
3.2 x 1.60 x 1.6mm
3.5 x 2.80 x 1.9mm
2.0 x 1.25 x 1.1mm
ESD Sensitive
Page (6) of (15)
Abracon Drawing # 603389
Revision #: Initial Release
6.0
Mechanical Dimensions
6.1
Recommended Land Pattern
Dimensions: mm
Dimension
Code
L
W
H
F(±0.10)
S(±0.30)
A
B
C
P
2.0±0.15
1.25±0.15
1.1±0.15
0.9
0.5
1.1
1.05
1.2
A
3.2±0.20
1.6±0.20
1.6±0.20
1.2
0.8
1.1
1.35
1.5
B
3.5±0.2
2.8±0.2
1.9±0.2
2.2
0.8
1.4
1.35
2.7
Dimension
Code
L
W
H
F(±0.10)
S(±0.30)
A
B
C
P
2.0±0.15
1.25±0.15
1.1±0.15
0.9
0.5
1.1
1.05
1.2
A
3.2±0.20
1.6±0.20
1.6±0.20
1.2
0.8
1.1
1.35
1.5
B
3.5±0.2
2.8±0.2
1.9±0.2
2.2
0.8
1.4
1.35
2.7
Materials
*The Case is black molded
Preheat condition: 150 ~200˚C /60~120sec.
∆ Allowed time above 217˚C: 60~90sec.
∆ Max temp: 260˚C
∆ Max time at max temp: 10sec.
∆ Solder paste: Sn/3.0Ag/0.5Cu
∆ Allowed Reflow time: 2x max
REFLOW PROFILE:
Date of Issue:
6.0
Mechanical Dimensions
6.1
Dimensions: mm
Dimension


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