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AS3661 Datasheet(PDF) 8 Page - ams AG |
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AS3661 Datasheet(HTML) 8 Page - ams AG |
8 / 87 page www.austriamicrosystems.com Revision 1.3 7 - 85 AS3661 Datasheet - A b s o l u t e M a x i m u m R a t i n g s 5 Absolute Maximum Ratings Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in Table 3. Electrical Characteristics on page 8 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 2. Absolute Maximum Ratings Parameter Min Max Units Comments VBAT, VCP, C1+, C1-, C2+, C2- to GND -0.3 +7.0 V VCP to VBAT -0.3 V Diode between VCP and VBAT LED1, LED2....LED9 to GND -0.3 +7.0 V SDA, SCL, EN, CLK32K, TRIG, INT, GPO, ASEL0, ASEL1 to GND -0.3 +7.0 V Electrostatic Discharge ESD HBM (LED1 to LED2) 8 kV JEDEC JESD22-A114 ESD HBM (all other pins) 2.5 kV ESD MM 250 V JEDEC JESD22-A115 ESD CDM 1 kV JEDEC JESD22-C101 Temperature Ranges and Storage Conditions Continous Power Dissipation Internally limited (overtemperature protection) 1 1. Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typ.) and disengages at T J = 130°C (typ.). Junction Temperature (TJMAX) +125 ºC Storage Temperature Range -55 +125 ºC Body Temperature during Soldering +260 ºC IPC/JEDEC J-STD-020 Junction to Ambient Thermal Resistance ( θ JA) 2 2. Junction to ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists, special care must be paid to thermal dissipation issues in board design. 87 °C/W Moisture Sensitive Level 1 Represents a max. floor life time of unlimited Recommended Operating Conditions Recommended charge pump load current 0 100 mA |
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