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ADP2108AUJZ-3.0-R7 Datasheet(PDF) 4 Page - Analog Devices |
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ADP2108AUJZ-3.0-R7 Datasheet(HTML) 4 Page - Analog Devices |
4 / 20 page ADP2108 Data Sheet Rev. G | Page 4 of 20 ABSOLUTE MAXIMUM RATINGS Table 2. Parameter Rating VIN, EN −0.4 V to +6.5 V FB, SW to GND −1.0 V to (VIN + 0.2 V) Operating Ambient Temperature Range −40°C to +125°C Operating Junction Temperature Range −40°C to +125°C Storage Temperature Range −65°C to +150°C Lead Temperature Range −65°C to +150°C Soldering (10 sec) 300°C Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C ESD Human Body Model ±1500 V ESD Charged Device Model ±500 V ESD Machine Model ±100 V Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Absolute maximum ratings apply individually only, not in combination. Unless otherwise specified, all other voltages are referenced to GND. The ADP2108 can be damaged when the junction temperature limits are exceeded. Monitoring ambient temperature does not guarantee that TJ is within the specified temperature limits. In applications with high power dissipation and poor thermal resistance, the maximum ambient temperature may have to be derated. In applications with moderate power dissipation and low PCB thermal resistance, the maximum ambient temperature can exceed the maximum limit as long as the junction temperature is within specification limits. The junction temperature (TJ) of the device is dependent on the ambient temperature (TA), the power dissipation (PD) of the device, and the junction-to- ambient thermal resistance of the package (θJA). Maximum junction temperature (TJ) is calculated from the ambient temperature (TA) and power dissipation (PD) using the formula TJ = TA + (PD × θJA). THERMAL RESISTANCE θJA is specified for a device mounted on a JEDEC 2S2P PCB. Table 3. Thermal Resistance Package Type θJA Unit 5-Ball WLCSP 105 °C/W 5-Lead TSOT 170 °C/W ESD CAUTION |
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