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TB6674PG Datasheet(PDF) 1 Page - Toshiba Semiconductor

Part # TB6674PG
Description  TOSHIBA BiCD Integrated Circuit Silicon Monolithic
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Manufacturer  TOSHIBA [Toshiba Semiconductor]
Direct Link  http://www.semicon.toshiba.co.jp/eng
Logo TOSHIBA - Toshiba Semiconductor

TB6674PG Datasheet(HTML) 1 Page - Toshiba Semiconductor

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TB6674PG/FG/FAG
Ver.3
2010-07-07
1
TOSHIBA BiCD Integrated Circuit Silicon Monolithic
TB6674PG, TB6674FG, TB6674FAG
Stepping Motor Driver IC
TB6674PG, TB6674FG, and TB6674FAG are stepping motor
driver ICs with MOS output transistors.
The ICs can control two-phase stepping motor forward and
reverse by bipolar driving. They have a power-saving circuit and
a standby circuit.
Features
They are similar substituting products of TA7774PG,
TA7774FG, and TA7774FAG. Both products have same
packages and same pin assignments.
One-chip two-phase bipolar stepping motor driver (including
two bridge drivers)
Power saving operation is available.
Standby operation is available.
Current consumption ≤ 20 μA (typ.)
Built-in punch-through current restriction circuit for system
reliability and noise suppression.
TTL-compatible inputs INA, INB, PS, and Vs2B terminals
ON resistance PS = L : 2.9 Ω (Typ.)
PS = H: 7.9 Ω (Typ.)
High driving ability.
<TB6674PG/FG>
: IO (START) 350 mA (MAX.) : VS1 ENABLE
: IO (HOLD) 100 mA (MAX.) : VS2 ENABLE
<TB6674FAG>
: IO (START) 100 mA (MAX.) : VS1 ENABLE
: IO (HOLD) 50 mA (MAX.)
: VS2 ENABLE
Typical PKG
DIP16 pin, HSOP16 pin, SSOP16 pin
GND terminal = HEAT SINK
Process :BiCD0.6 (30 V)
Over current shutdown circuit (ISD).
Thermal shutdown circuit (TSD).
Undervoltage lockout circuit (UVLO).
Pull-down resistance for input terminal (250 kΩ).
TB6674PG
TB6674FG
TB6674FAG
Weight
DIP16-P-300-2.54A: 1.11 g (typ.)
HSOP16-P-300-1.00: 0.50 g (typ.)
SSOP16-P-225-1.00A: 0.14 g (typ.)
The following conditions apply to solderability:
About solderability, following conditions were confirmed
(1)Use of Sn-37Pb solder Bath
·solder bath temperature: 230℃
·dipping time: 5 seconds
·the number of times: once
·use of R-Type flux
(2)Use of Sn-3.0Ag-0.5Cu solder Bath
·solder bath temperature: 245℃
·dipping time: 5 seconds
·the number of times: once
·use of R-type flux


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