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AME8845BEDS250Z Datasheet(PDF) 9 Page - Analog Microelectronics |
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AME8845BEDS250Z Datasheet(HTML) 9 Page - Analog Microelectronics |
9 / 19 page AME 9 AME8845 3A CMOS LDO Rev.C.03 n Thermal Information(contd.) ** MIL-STD-202G 210F Parameter Package Die Attach Symbol Maximum Unit Conductive Epoxy 55 Non-Conductive Epoxy 80 Conductive Epoxy 90 Non-Conductive Epoxy 140 Conductive Epoxy 80 Non-Conductive Epoxy 100 Conductive Epoxy 120 Non-Conductive Epoxy 135 Conductive Epoxy 2200 Non-Conductive Epoxy 1600 Conductive Epoxy 1200 Non-Conductive Epoxy 1000 Conductive Epoxy 1700 Non-Conductive Epoxy 1400 Conductive Epoxy 900 Non-Conductive Epoxy 800 150 oC 350 oC Internal Power Dissipation SOT-223 PD TO-220-3 TO-252-2 Thermal Resistance (Junction to Ambient) θ JA oC / W mW Maximum Junction Temperature Solder Iron(10 Sec)** TO-263-3 SOT-223 TO-220-3 TO-252-2 TO-263-3 |
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