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NE5550779A-T1-A Datasheet(PDF) 1 Page - Renesas Technology Corp |
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NE5550779A-T1-A Datasheet(HTML) 1 Page - Renesas Technology Corp |
1 / 17 page R09DS0040EJ0300 Rev.3.00 Page 1 of 15 Mar 12, 2013 The mark <R> shows major revised points. The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field. Data Sheet NE5550779A Silicon Power LDMOS FET FEATURES • High Output Power : Pout = 38.5 dBm TYP. (VDS = 7.5 V, IDset = 140 mA, f = 460 MHz, Pin = 25 dBm) • High power added efficiency : ηadd = 66% TYP. (VDS = 7.5 V, IDset = 140 mA, f = 460 MHz, Pin = 25 dBm) • High Linear gain : GL = 22.0 dB TYP. (VDS = 7.5 V, IDset = 140 mA, f = 460 MHz, Pin = 10 dBm) • High ESD tolerance • Suitable for VHF to UHF-BAND Class-AB power amplifier. APPLICATIONS • 150 MHz Band Radio System • 460 MHz Band Radio System • 900 MHz Band Radio System ORDERING INFORMATION Part Number Order Number Package Marking Supplying Form NE5550779A NE5550779A-A 79A (Pb-Free) W8 • 12 mm wide embossed taping • Gate pin faces the perforation side of the tape NE5550779A-T1 NE5550779A-T1-A • 12 mm wide embossed taping • Gate pin faces the perforation side of the tape • Qty 1 kpcs/reel NE5550779A-T1A NE5550779A-T1A-A • 12 mm wide embossed taping • Gate pin faces the perforation side of the tape • Qty 5 kpcs/reel Remark To order evaluation samples, please contact your nearby sales office. Part number for sample order: NE5550779A ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise specified) Operation in excess of any one of these parameters may result in permanent damage. Parameter Symbol Ratings Unit Drain to Source Voltage VDS 30 V Gate to Source Voltage VGS 6.0 V Drain Current IDS 2.1 A Drain Current (50% Duty Pulsed) IDS-pulse 4.2 A Total Power Dissipation Note Ptot 17.8 W Channel Temperature Tch 150 °C Storage Temperature Tstg −55 to +150 °C Note: Value at TC = 25 °C CAUTION Observe precautions when handling because these devices are sensitive to electrostatic discharge. R09DS0040EJ0300 Rev.3.00 Mar 12, 2013 |
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