TPS23770PWPR datasheet(3/41 Pages) TI1

Part #	TPS23770PWPR

Description	INTEGRATED 100-V IEEE 802.3af PD AND DC/DC CONTROLLER

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RECOMMENDED OPERATING CONDITIONS

(1) (2)

DISSIPATION RATINGS TABLE

TPS23750

TPS23770

SLVS590B – JULY 2005 – REVISED FEBRUARY 2008

All voltage values are with respect to VSS unless otherwise noted.

MIN

NOM

MAX

UNIT

VDD

Input voltage range(3)

COM, SEN, SENP

0

67

V

FB, COMP, MODE, BL

0

VBIAS

Input voltage range

AUX to COM

0

16

V

RSP to RSN

0

1

AUX

0

2

Sourcing current

VBIAS

0

2

mA

COMP

0

2

QG

GATE loading

20

nC

AUX load capacitance

0.8

25

µF

VBIAS load capacitance

0.08

1.5

µF

RFREQ

30

300

k

Ω

TJ

Operating junction temperature range

-40

125

°C

TA

Operating ambient temperature range

-40

85

°C

(1)

RSN, COM, and RTN should be tied together. SENP should be tied to VDD except for the buck configuration, where it should be tied to

the output positive rail.

(2)

TMR, FREQ, CLASS, DET, VBIAS, and GATE should not be externally driven.

(3)

Junction temperature may be a constraining factor for high bias power designs.

θ

JP

θ

JC

θ

JA

θ

JA

θ

JA

MAXIMUM POWER RATING

PACKAGE

°C/W(1)

°C/W

°C/W(2)

°C/W(3)

°C/W(4)

(W)(5)

PWP (TSSOP-20)

1.4

26.62

32.6

151.9

73.8

1.2

(1)

Thermal resistance junction to pad.

(2)

See TI document SLMA002 for recommended layout. This is a best case, zero airflow number.

(3)

JEDEC method with low-k board (2 signal layers) and power pad not soldered (worst case).

(4)

JEDEC method with high-k board (4 layers, 2 signal and 2 planes) and power pad not soldered.

(5)

Based on TI recommended layout and 85

°C ambient.

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