YZV PACKAGE

(TOP VIEW)

A

GND

Y

V

CC

A1

A2

B1

B2

DNU – Do not use

YZP PACKAGE

(TOP VIEW)

A

GND

DNU

V

CC

Y

C2

C1

B1

B2

A1

A2

N.C. – No internal connection

See mechanical drawings for dimensions.

DBV PACKAGE

(TOP VIEW)

2

5

3

4

Y

1

A

GND

N.C.

V

CC

DCK PACKAGE

(TOP VIEW)

3

4

2

Y

1

GND

A

N.C.

5

V

CC

DRL PACKAGE

(TOP VIEW)

2

A

1

N.C.

3

4

GND

Y

5

V

CC

DRY PACKAGE

(TOP VIEW)

A

N.C.

N.C.

6

5

4

2

3

GND

Y

V

CC

1

N.C.

GND

DSF PACKAGE

(TOP VIEW)

A

V

CC

Y

N.C.

6

5

4

2

3

1

SN74LVC1G06

www.ti.com

SCES295V – JUNE 2000 – REVISED NOVEMBER 2012

SINGLE INVERTER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUT

Check for Samples: SN74LVC1G06

1

FEATURES

2

•

Available in the Texas Instruments

•

NanoFree™ Package

Down Mode, and Back Drive Protection

•

•

Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

•

Input and Open-Drain Output Accept

Voltages up to 5.5 V

•

ESD Protection Exceeds JESD 22

•

–

2000-V Human-Body Model (A114-A)

•

Low Power Consumption, 10-

–

200-V Machine Model (A115-A)

•

±24-mA Output Drive at 3.3 V

–

1000-V Charged-Device Model (C101)

Table 1. YZP PACKAGE TERMINAL

ASSIGNMENTS

1

2

A

DNU

B

A

No ball

C

GND

Y

Table 2. YZV PACKAGE TERMINAL

ASSIGNMENTS

1

2

A

A

B

GND

Y

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2

NanoFree is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Copyright © 2000–2012, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.