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ADS58H40IZCR Datasheet(PDF) 3 Page - Texas Instruments |
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ADS58H40IZCR Datasheet(HTML) 3 Page - Texas Instruments |
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3 / 59 page  ADS58H40 www.ti.com SBAS589B – AUGUST 2012 – REVISED NOVEMBER 2012 THERMAL INFORMATION ADS58H40 THERMAL METRIC(1) ZCR (BGA) UNITS 144 PINS θJA Junction-to-ambient thermal resistance 35.9 θJCtop Junction-to-case (top) thermal resistance 5.1 θJB Junction-to-board thermal resistance 12.6 °C/W ψJT Junction-to-top characterization parameter 0.1 ψJB Junction-to-board characterization parameter 12.4 θJCbot Junction-to-case (bottom) thermal resistance N/A SPACER (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. RECOMMENDED OPERATING CONDITIONS MIN NOM MAX UNIT SUPPLIES AVDD33 3.15 3.3 3.45 V AVDD Supply voltage 1.8 1.9 2.0 V DRVDD 1.7 1.8 2.0 V ANALOG INPUTS Differential input voltage range 2 VPP Input common-mode voltage VCM ± 0.025 V Analog input common-mode current (per input pin of each channel) 1.5 µA/MSPS VCM current capability 5 mA 2-VPP input amplitude (1) 400 MHz Maximum analog input frequency 1.4-VPP input amplitude 500 MHz CLOCK INPUTS Input clock sample rate 184(2) 250 MSPS Sine wave, ac-coupled 0.2 1.5 VPP LVPECL, ac-coupled 1.6 VPP Input clock amplitude differential (VCLKP – VCLKM) LVDS, ac-coupled 0.7 VPP LVCMOS, single-ended, ac-coupled 1.8 VPP Input clock duty cycle 40% 50% 60% DIGITAL OUTPUTS Maximum external load capacitance from each output pin to DRVSS CLOAD 3.3 pF (default strength) RLOAD Differential load resistance between the LVDS output pairs (LVDS mode) 100 Ω TEMPERATURE RANGE TA Operating free-air temperature –40 +85 °C Recommended +105 °C TJ Operating junction temperature Maximum rated(3) +125 °C (1) See the Theory of Operation section. (2) The minimum functional clock speed can be 10 MSPS after writing the following special modes: address 4Ah, value 01h; address 62h, value 01h; address 92h, value 01h; and address 7Ah, value 01h. See the SPECIAL MODE[17:14] bits in Table 4 of the Serial Interface Registers section. (3) Prolonged use at this junction temperature may increase the device failure-in-time (FIT) rate. Copyright © 2012, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: ADS58H40 |
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