TIBPAL16L8-25C, TIBPAL16R4-25C, TIBPAL16R6-25C, TIBPAL16R8-25C

TIBPAL16L8-30M, TIBPAL16R4-30M, TIBPAL16R6-30M, TIBPAL16R8-30M

LOW-POWER HIGH-PERFORMANCE

SRPS059A − FEBRUARY 1984 − REVISED DECEMBER 2010

1

POST OFFICE BOX 655303

Propagation Delay

C Suffix . . . 25 ns Max

M Suffix...30 ns Max

PAL16L8A, PAL16R4A, PAL16R6A, and

PAL16R8A

Register Outputs Are Set High, but Voltage

Levels at the Output Pins Go Low)

Ceramic Chip Carriers in Addition to Plastic

and Ceramic DIPs

Reliability

DEVICE

I

INPUTS

3-STATE

O

OUTPUTS

REGISTERED

Q

OUTPUTS

I/O

PORTS

PAL16L8

10

2

0

6

PAL16R4

8

0

4 (3-state

buffers)

4

PAL16R6

8

0

6 (3-state

buffers)

2

PAL16R8

8

0

8 (3-state

buffers)

0

description

These programmable array logic devices feature

high speed and functional equivalency when

compared with currently available devices. These

IMPACT™ circuits combine the latest Advanced

Low-Power Schottky technology with proven

titanium-tungsten fuses to provide reliable,

high-performance substitutes for conventional

TTL logic. Their easy programmability allows for

quick design of custom functions and typically

results in a more compact circuit board. In

addition, chip carriers are available for further

reduction in board space.

The TIBPAL16’ C series is characterized from 0°C

to 75°C. The TIBPAL16’ M series is characterized

for operation over the full military temperature

range of −55°C to 125°C.

Copyright © 2010, Texas Instruments Incorporated

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

IMPACT is a trademark of Texas Instruments.

PAL is a registered trademark of Advanced Micro Devices Inc.

1

2

3

4

5

6

7

8

9

10

20

19

18

17

16

15

14

13

12

11

I

I

I

I

I

I

I

I

I

GND

O

I/O

I/O

I/O

I/O

I/O

I/O

O

I

TIBPAL16L8’

C SUFFIX ...J OR N PACKAGE

M SUFFIX ...J OR W PACKAGE

(TOP VIEW)

4

5

6

7

8

18

17

16

15

14

I/O

I/O

I/O

I/O

I/O

I

I

I

I

I

TIBPAL16L8’

C SUFFIX . . . FN PACKAGE

M SUFFIX . . . FK PACKAGE

(TOP VIEW)

32 1 20 19

910 11 12 13