NSI45090JD, NSV45090JD

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7

Thermal Considerations

As power in the CCR increases, it might become

necessary to provide some thermal relief. The maximum

power dissipation supported by the device is dependent

upon board design and layout. Mounting pad configuration

on the PCB, the board material, and the ambient temperature

affect the rate of junction temperature rise for the part. When

the device has good thermal conductivity through the PCB,

the junction temperature will be relatively low with high

power applications. The maximum dissipation the device

can handle is given by:

Referring to the thermal table on page 2 the appropriate

AC Applications

The CCR is a DC device; however, it can be used with full

wave rectified AC as shown in application notes

AND8433/D and AND8492/D and design notes

DN05013/D and DN06065/D. Figure 15 shows the basic

circuit configuration.

Figure 15. Basic AC Application