NLASB3157

http://onsemi.com

10

PACKAGE DIMENSIONS

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.25 AND 0.30mm FROM TERMINAL.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

C

A

SEATING

PLANE

D

B

E

0.10 C

A3

A

A1

2X

2X

0.10 C

WDFN6 1.2x1.0, 0.4P

CASE 506AS

ISSUE D

DIM

A

MIN

MAX

MILLIMETERS

0.70

0.80

A1

0.00

0.05

A3

0.20 REF

b

0.15

0.25

D

E

e

L

PIN ONE

REFERENCE

0.08 C

0.10 C

7X

A

0.10 C

NOTE 3

L2

e

b

B

3

6

6X

1

4

0.05 C

4X

MOUNTING FOOTPRINT*

L1

1.20 BSC

1.00 BSC

0.40 BSC

0.30

0.40

0.00

0.15

BOTTOM VIEW

L

5X

DIMENSIONS: MILLIMETERS

0.22

6X

0.42

6X

1.07

0.40

PITCH

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

L1

DETAIL A

L

ALTERNATE TERMINAL

CONSTRUCTIONS

A1

A3

L

DETAIL B

MOLD CMPD

EXPOSED Cu

ALTERNATE

CONSTRUCTIONS

DETAIL B

DETAIL A

L2

0.40

0.50

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