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MMSZ5236ET1G Datasheet(PDF) 1 Page - ON Semiconductor |
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MMSZ5236ET1G Datasheet(HTML) 1 Page - ON Semiconductor |
1 / 6 page Semiconductor Components Industries, LLC, 2012 February, 2012 − Rev. 8 1 Publication Order Number: MMSZ5221ET1/D MMSZ52xxET1G Series, SZMMSZ52xxET1G Series Zener Voltage Regulators 500 mW SOD−123 Surface Mount Three complete series of Zener diodes are offered in the convenient, surface mount plastic SOD−123 package. These devices provide a convenient alternative to the leadless 34−package style. Features 500 mW Rating on FR−4 or FR−5 Board Wide Zener Reverse Voltage Range − 2.4 V to 110 V Package Designed for Optimal Automated Board Assembly Small Package Size for High Density Applications General Purpose, Medium Current ESD Rating of Class 3 (> 16 kV) per Human Body Model Peak Power − 225 W (8 x 20 ms) SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable Pb−Free Packages are Available* Mechanical Characteristics: CASE: Void-free, transfer-molded, thermosetting plastic case FINISH: Corrosion resistant finish, easily solderable MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260C for 10 Seconds POLARITY: Cathode indicated by polarity band FLAMMABILITY RATING: UL 94 V−0 MAXIMUM RATINGS Rating Symbol Max Units Peak Power Dissipation @ 20 ms (Note 1) @ TL 25C Ppk 225 W Total Power Dissipation on FR−5 Board, (Note 3) @ TL = 75C Derated above 75C PD 500 6.7 mW mW/C Thermal Resistance, (Note 2) Junction−to−Ambient RqJA 340 C/W Thermal Resistance, (Note 2) Junction−to−Lead RqJL 150 C/W Junction and Storage Temperature Range TJ, Tstg −55 to +150 C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Nonrepetitive current pulse per Figure 11. 2. Thermal Resistance measurement obtained via infrared Scan Method. 3. FR−5 = 3.5 x 1.5 inches, using the minimum recommended footprint. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOD−123 CASE 425 STYLE 1 1 Cathode 2 Anode See specific marking information in the device marking column of the Electrical Characteristics table on page 2 of this data sheet. DEVICE MARKING INFORMATION http://onsemi.com Device Package Shipping† ORDERING INFORMATION MARKING DIAGRAM †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. MMSZ52xxET1G SOD−123 (Pb−Free) 3,000 / Tape & Reel MMSZ52xxET3G SOD−123 (Pb−Free) 10,000 / Tape & Reel xxx = Device Code (Refer to page 2) M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) xxx M G G 1 SZMMSZ52xxET1G SOD−123 (Pb−Free) 3,000 / Tape & Reel |
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