Sensing element／Gauge

5

Reflow Soldering process recommendation profile

a: Rump up rate

1 or 2 deg.C/sec.

b: Pre-heating

150 to 180 deg.C,within 60 to120sec.

c: Rump up rate

1 to 2 deg.C/sec.

d: Heating

max.230 deg.C,max.10sec. 210 deg.C,within 30sec.

e: Rump down rate

1 or 2 deg.C/sec.

Note ;

1 ) Temperature means Surface temperature of the sensor package.

2 ) Reflow process max. 2 times.

3 ) Do not wash the sensor.

4 ) Do not put the solder and flux on the sensor package.

If you have any questions regarding technical issues or specifications, please contact us.

Fujikura Ltd. Sensor Department

5-1 Kiba 1-chome, Koto-ku, Tokyo 135-8512, Japan

Phone +81-(0)3-5606-1072

Package

Surface

Temperature

(Degree C)

210

150

Room

Temp.

a

b

c

d

e

230

Time