3

Table 3. Thermal Properties

Parameter

Test Conditions

Value

Channel Temperature, Tch

Tch=150 °C

(Channel-to-Base Plate),

qch-bs

Ambient operational temperature TA = 25°C

Channel-to-backside Thermal Resistance Tchannel(Tc)=34°C

Thermal Resistance at backside temperature Tb=25°C

Note:

1. Assume AnPb soldering to an evaluation RF module at 90.5 °C base plate temperatures.

Absolute Minimum and Maximum Ratings

Description Pin

Min.

Max.

Unit

Comments

5.5

V

Gate Supply Voltage, Vg

-2

0

6

20

dBm

CW

+150

°C

Storage Temperature

-65

+155

°C

Maximum Assembly Temperature

+260

°C

30 second maximum

Notes:

1. Operation in excess of any one of these conditions may result in permanent damage to this device.

2. Combinations of supply voltage, drain current, input power, and output power shall not exceed PD.

3. These ratings apply to each individual FET

4. The operating channel temperature will directly affect the device MTTF. For maximum life, it is recommended that junction temperatures be

maintained at the lowest possible levels.