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PR0805FKM7W0R001 Datasheet(PDF) 9 Page - YAGEO Corporation |
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PR0805FKM7W0R001 Datasheet(HTML) 9 Page - YAGEO Corporation |
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9 / 10 page  Chip Resistor Surface Mount www.yageo.com Nov 01, 2011 V.0 Product specification 9 10 SERIES PR/PF/PH 0805/1206/2512/0815 TEST TEST METHOD PROCEDURE REQUIREMENTS Solderability - Wetting IPC/JEDECJ-STD-002B test B IEC 60068-2-58 Electrical Test not required Magnification 50X SMD conditions: 1st step: method B, aging 4 hours at 155 °C dry heat 2nd step: leadfree solder bath at 245±3 °C Dipping time: 3±0.5 seconds Well tinned (≥95% covered) No visible damage - Leaching IPC/JEDECJ-STD-002B test D IEC 60068-2-58 Leadfree solder, 260 °C, 30 seconds immersion time No visible damage - Resistance to Soldering Heat MIL-STD-202G-method 210F IEC 60068-2-58 Condition B, no pre-heat of samples Leadfree solder, 260 °C, 10 seconds immersion time Procedure 2 for SMD: devices fluxed and cleaned with isopropanol ±(0.5%+0.0005 Ω) No visible damage |
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