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431315300230 Datasheet(PDF) 8 Page - YAGEO Corporation |
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431315300230 Datasheet(HTML) 8 Page - YAGEO Corporation |
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8 / 13 page  Phycomp Product specification High Frequency SMD type antennas for BT/802.11b/g application 2.45 GHz size 5.3 × 2.0 2004 Oct 12 Rev.4 8 www.yageo.com TESTS AND REQUIREMENTS Table 4 Test procedures and requirements IEC 384-10/ CECC32 100 CLAUSE IEC 60068-2 TEST METHOD TEST PROCEDURE REQUIREMENTS 4.4 mounting the antenna may be mounted on printed-circuit boards or ceramic substrates by applying wave soldering, reflow soldering (including vapour phase soldering) or conductive adhesive no visible damage 4.5 visual inspection and dimension check any applicable method using × 10 magnification in accordance with specification (chip off 4 mm) 4.8 adhesion a force of 3 N applied for 10 s to the line joining the terminations and in a plane parallel to the substrate mounted in accordance with CECC 32 100, paragraph 4.4 no visible damage 4.9 bond strength of plating on end face conditions: bending 0.5 mm at a rate of 1 mm/s; radius jig: 340 mm; 2 mm warp on FR4 board of 90 mm length no visible damage resistance to soldering heat 260 ±5 °C for 10 ±5 s in a static solder bath the terminations should be well tinned after recovery; central frequency changed to ±6% 4.10 20 (Tb) resistance to leaching at 260 ±5 °C for 30 ±1 s in a static solder bath using visual enlargement of × 10, dissolution of the terminations should not exceed 10% 4.11 20 (Ta) solderability zero hour test, and test after storage (20 to 24 months) in original atmosphere; unmounted chips completely immersed for 2 ±0.5 s at 235 ±5 °C good tinning ( ≥ 75% covered) at terminations |
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