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PR0805GKM7W0R05 Datasheet(PDF) 8 Page - YAGEO Corporation |
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PR0805GKM7W0R05 Datasheet(HTML) 8 Page - YAGEO Corporation |
8 / 10 page Chip Resistor Surface Mount www.yageo.com Nov 01, 2011 V.0 Product specification 8 10 SERIES PR/PF/PH 0805/1206/2512/0815 TESTS AND REQUIREMENTS TEST TEST METHOD PROCEDURE REQUIREMENTS Life/ Operational Life/ Endurance MIL-STD-202G-method 108A IEC 60115-1 4.25.1 JIS C 5202-7.10 1,000 hours at 70±5 °C applied RCWV 1.5 hours on, 0.5 hour off, still air required ±(1%+0.0005 Ω) High Temperature Exposure/ Endurance at Upper Category Temperature MIL-STD-202G-method 108A IEC 60115-1 4.25.3 JIS C 5202-7.11 1,000 hours at maximum operating temperature depending on specification, unpowered No direct impingement of forced air to the parts Tolerances: 155±3 °C ±(1%+0.0005 Ω) Moisture Resistance MIL-STD-202G-method 106F IEC 60115-1 4.24.2 Each temperature / humidity cycle is defined at 8 hours (method 106F), 3 cycles / 24 hours for 10d with 25 °C / 65 °C 95% R.H, without steps 7a & 7b, unpowered Parts mounted on test-boards, without condensation on parts Measurement at 24±2 hours after test conclusion ±(0.5%+0.0005 Ω) Thermal Shock MIL-STD-202G-method 107G -55/+155 °C Note: Number of cycles required is 300. Devices unmounted Maximum transfer time is 20 seconds. Dwell time is 15 minutes. Air – Air ±(0.5%+0.0005 Ω) Short Time Overload MIL-R-55342D-para 4.7.5 IEC60115-1 4.13 5 times of rated power for 5 seconds at room temperature ±(0.5%+0.0005 Ω) No visible damage Board Flex/ Bending IEC60115-1 4.33 Device mounted on PCB test board as described, only 1 board bending required Bending for 0805: 3 mm 1206/2512/other: 2 mm Holding time: minimum 60 seconds ±(1%+0.05 Ω) No visible damage Table 4 Test condition, procedure and requirements |
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