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ALFG1PF241 Datasheet(PDF) 5 Page - Panasonic Semiconductor |
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ALFG1PF241 Datasheet(HTML) 5 Page - Panasonic Semiconductor |
5 / 6 page Panasonic Corporation 2013 © Panasonic Corporation Automation Controls Buisiness Division industrial.panasonic.com/ac/e/ LF-G (ALFG) –5– ASCTB196E-1 201307-T DIMENSIONS (mm inch) SAFETY STANDARDS NOTES Certification authority Standard type High capacity type Contact Gap 1.5 mm .059 inch type Contact Gap 1.8 mm .071 inch type Contact Gap 1.5 mm .059 inch type Contact Gap 1.8 mm .071 inch type UL/C-UL 22A 277V AC General Use (at 85 °C 185°F) 31A 277V AC General Use (at 85 °C 185°F) 33A 277V AC General Use (at 85 °C 185°F) VDE (VDE0435) 22A 250V AC cos φ = 0.8 (at 85°C 185°F) 31A 250V AC cos φ = 0.8 (at 85°C 185°F) 33A 250V AC cos φ = 0.8 (at 85°C 185°F) The CAD data of the products with a CAD Data mark can be downloaded from: http://industrial.panasonic.com/ac/e/ External dimensions 23.3 .917 4.0 .157 0.5 .020 15.7 .618 12.0 .472 22.0 .866 27.6 1.087 30.1 1.185 PC board pattern (Bottom view) Tolerance: ±0.1 ±.004 Schematic (Bottom view) 10.0 ±0.1 .394 ±.004 27.6 ±0.1 1.087 ±.004 12.0 ±0.1 .472 ±.004 13.8 ±0.1 .543 ±.004 12.0 ±0.1 .472 ±.004 1.8 dia. .071 dia. 1.8 dia. .071 dia. 2.0 dia. .079 dia. 2.0 dia. .079 dia. NO COM CAD Data Dimension: Less than 1mm .039inch: Min. 1mm .039inch less than 3mm .118 inch: Min. 3mm .118 inch: General tolerance ±0.1 ±.004 ±0.2 ±.008 ±0.3 ±.012 Usage, transport and storage conditions 1) Temperature: –40 to +60 °C –40 to +140°F (When nominal coil voltage applied) –40 to +85 °C –40 to +185°F (When coil holding voltage is 45% to 80% of the nominal coil voltage) 2) Humidity: 5 to 85% RH (Avoid freezing and condensation.) The humidity range varies with the temperature. Use within the range indicated in the graph below. 3) Atmospheric pressure: 86 to 106 kPa Temperature and humidity range for usage, transport, and storage ∗ –40 to +85°C –40 to +185°F (When 45% to 80%V of coil holding voltage) 4) Condensation Condensation forms when there is a sudden change in temperature under high temperature and high humidity conditions. Condensation will cause deterioration of the relay insulation. 5) Freezing Condensation or other moisture may freeze on the relay when the temperatures is lower than 0 °C 32°F.This causes problems such as sticking of movable parts or operational time lags. 6) Low temperature, low humidity environments The plastic becomes brittle if the relay is exposed to a low temperature, low humidity environment for long periods of time. Solder and cleaning conditions 1) Please obey the following conditions when soldering automatically. (1) Preheating: Within 120 °C 248°F (solder surface terminal portion) and within 120 seconds (2) Soldering iron: 260 °C±5°C 500 °F±41°F (solder temperature) and within 6 seconds (soldering time) 2) Since this is not a sealed type relay, do not clean it as is. Also, be careful not to allow flux to overflow above the PC board or enter the inside of the relay. 85 5 060 –40 Humidity, %RH Tolerance range +32 +140 –40 Temperature, °C °F (Avoid freezing when used at temperatures lower than 0 °C (Avoid condensation when used at temperatures higher than 0 °C 32°F) 32 °F) 85 5 Humidity, %RH Tolerance range (Avoid condensation when used at temperatures higher than 0 °C 32°F) (Avoid freezing when used at temperatures lower than 0 °C 32°F) 85 0 –40 +185 +32 –40 Temperature, °C °F |
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