5

Intensity Bin Limit (mcd)

Blue

Iv Bin Category

Min

Max

L

3.401

5.400

M

5.401

8.600

N

8.601

13.700

Tolerance +/-15%

Note:

1. Bin categories are established for classification of products. Products

may not be available in all categories. Please contact your Avago

representative for information on currently available bins.

SMT Soldering Profile

Pb free reflow soldering Profile

Recommended soldering pattern (unit: mm)

250°C

TIME

6°C/SEC. MAX.

100 SEC. MAX.

60 - 120 SEC.

3°C/SEC. MAX.

3°C/SEC. MAX.

10 - 30 SEC.

150°C

200°C

217°C

(Acc. to J-STD-020C)

3

2.54 x 5 = 12.7

9

2

Recommended stencil window opening is 80%

Notes:

1. The peak temperature refers to the peak package body temperature.

2. Number of reflow process shall be limited to maximum 2 times only.

Cooling process to normal temperature is required between first and

second soldering process.