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0603ESDA2-TR2 Datasheet(PDF) 2 Page - Cooper Bussmann, Inc. |
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0603ESDA2-TR2 Datasheet(HTML) 2 Page - Cooper Bussmann, Inc. |
2 / 2 page EIA Size L W H T 0603ESDA 1.60±0.15 0.80±0.10 0.60±0.10 0.31±0.21 (0.063±0.006) (0.031±0.004) (0.024±0.004) (0.012±0.008) © 2012 Cooper Bussmann www.cooperbussmann.com 0612 BU-SB12433 Page 2 of 2 Data Sheet 4419 The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any technical information con- tained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications. Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life sup- port systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Tc -5°C t Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Preheat Area Tsmax Tsmin ts Tp TL Time 25 Time 25°C to Peak Supplier Tp > Tc - Supplier tp Tc User Tp < Tc - User tp Tc -5°C tp Soldering Recommendations • Compatible with lead and lead-free solder reflow processes • Peak temperatures and durations: - IR Reflow = 260°C max for 30 sec. max. Capable of 3X reflow. - Wave Solder = 260°C max. for 10 sec. max. - Hand Soldering = 350°C max. for 5 sec. max. Recommended IR Reflow Profile Tape and Reel Specifications - mm (in) W L H T 1.0max (0.039max) 1.1ref (0.043 ref) 0.60min (0.023min) (per IPC-SM-782 ) Recommended Pad Layout - in (mm) Environmental Specifications: • Coating bond strength: ASTM D3359-83, Method A, Section 6. Note: the device coating is not scored. • Chemical resistance: ASTM D-543, 4 hrs @ 40°C, 3 solutions (H 2O, detergent solution, defluxer). • Humidity(steady state): MIL-STD-883, method 1004.7, 85% RH, 85°C, 240 hrs. • Thermal shock: MIL-STD-202F, method 107G, -65°C to 125°C, 30 min, 5 cycles. • Vibration: MIL-STD-202F,method 201A,(10 to 55 to 10Hz, 1 minute cycle, 2 hrs. each in X-Y-Z axis). • Solder leach resistance and terminal adhesion per EIA-567. • Solderability per MIL-STD-202, Method 208 (95% coverage). • Full load voltage: 14.4Vdc, 1000hrs., 25°C. • Operating temperature characteristics: Electrical testing at +105°C and -55°C. Dimensions - mm (in) Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Preheat & Soak Temperature min (Tsmin) 100°C 150°C Temperature max (Tsmax) 150°C 200°C Time (Tsmin to Tsmax) (ts) 60-120 seconds 60-120 seconds Average ramp-up rate (Tsmax to Tp) 3°C/second max. 3°C/second max. Liquidous temperature (TL) 183°C 217°C Time at liquidous (tL) 60-150 seconds 60-150 seconds Peak package body temperature (Tp)* See classification temp See classification temp in Table 4.1 in Table 4.2 Time (tp)** within 5°C of the specified 20** seconds 30** seconds classification temperature (Tc) Average ramp-down rate (Tp to Tsmax) 6°C/second max. 6°C/second max. Time 25°C to peak temperature 6 minutes max. 8 minutes max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. |
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