EIA Size

L

W

H

T

0603ESDA

1.60±0.15

0.80±0.10

0.60±0.10

0.31±0.21

(0.063±0.006) (0.031±0.004) (0.024±0.004) (0.012±0.008)

© 2012 Cooper Bussmann

www.cooperbussmann.com

0612

BU-SB12433

Page 2 of 2

Data Sheet 4419

The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is

intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, without notice, to change

design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any technical information con-

tained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.

Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life sup-

port systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result

in significant injury to the user.

t

Max. Ramp Up Rate = 3°C/s

Max. Ramp Down Rate = 6°C/s

Preheat Area

Time

25

Time 25°C to Peak

Supplier Tp > Tc

-

Supplier tp

Tc

User Tp < Tc

-

User tp

Tc -5°C

Soldering Recommendations

• Compatible with lead and lead-free solder reflow processes

• Peak temperatures and durations:

- IR Reflow = 260°C max for 30 sec. max. Capable of 3X reflow.

- Wave Solder = 260°C max. for 10 sec. max.

- Hand Soldering = 350°C max. for 5 sec. max.

Recommended IR Reflow Profile

Tape and Reel Specifications - mm (in)

W

L

H

T

1.0max

(0.039max)

1.1ref

(0.043 ref)

0.60min

(0.023min)

(per IPC-SM-782 )

Recommended Pad Layout - in (mm)

Environmental Specifications:

• Coating bond strength: ASTM D3359-83, Method A, Section 6.

Note: the device coating is not scored.

• Chemical resistance: ASTM D-543, 4 hrs @ 40°C, 3 solutions (H

detergent solution, defluxer).

• Humidity(steady state): MIL-STD-883, method 1004.7, 85% RH, 85°C,

240 hrs.

• Thermal shock: MIL-STD-202F, method 107G, -65°C to 125°C, 30

min, 5 cycles.

• Vibration: MIL-STD-202F,method 201A,(10 to 55 to 10Hz, 1 minute

cycle, 2 hrs. each in X-Y-Z axis).

• Solder leach resistance and terminal adhesion per EIA-567.

• Solderability per MIL-STD-202, Method 208 (95% coverage).

• Full load voltage: 14.4Vdc, 1000hrs., 25°C.

• Operating temperature characteristics: Electrical testing at

+105°C and -55°C.

Dimensions - mm (in)

Profile Feature

Sn-Pb Eutectic Assembly

Pb-Free Assembly

Preheat & Soak

100°C

150°C

150°C

200°C

60-120 seconds

60-120 seconds

3°C/second max.

3°C/second max.

183°C

217°C

60-150 seconds

60-150 seconds

See classification temp

See classification temp

in Table 4.1

in Table 4.2

20** seconds

30** seconds

6°C/second max.

6°C/second max.

Time 25°C to peak temperature

6 minutes max.

8 minutes max.