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RN-171-DS Datasheet(PDF) 11 Page - Microchip Technology

Part # RN-171-DS
Description  RN-171 802.11 b/g Wireless LAN Module
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

RN-171-DS Datasheet(HTML) 11 Page - Microchip Technology

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www.rovingnetworks.com
Version 3.21 10/2/2012
11
RN -17 1
The feed connecting the antenna to the RF pad must be 50 ohm in impedance. If this feed is shorter than 0.2" the board
can be 2 layers and the thickness of the feed is the same as described in the manufacturer’s data sheet. If the trace is
longer, you need a 4-layer board with controlled impedance, i.e., a ground plane directly under the top layer. The
thickness should be calculated accordingly.
Wire Antenna
To implement a wire antenna, drill a hole through the board on the RF pad (pin 24) to place the wire antenna. To provide
50 ohms of impedance matching, the RF path from the RF pad (Pin 24) to the location of the wire antenna should be
12 mils thick on a 4-layer PCB. See Figure 11. Roving Networks recommends that you use an 18-gauge wire with a length
of 1 inch ± 0.25. For best performance, the wire antenna should be perpendicular to the ground plane.
NOTE: There should be no thermal relief connectors on GND for RF path and on the ground plane.
Figure 11. Wire Antenna Location
  
 
U.FL Connector
Figure 12 shows one option for implementing a U.FL connector. The trace from the RF pad to the U.FL connector should
be 12 mils thick to achieve 50 ohms of impedance matching on a 4-layer board. The part number of the U.FL connector
used for certification of the module is U.FL-R-SM from Hirose.
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