TN815-x00B datasheet(4/13 Pages) STMICROELECTRONICS

Part #	TN815-x00B

Description	Sensitive and standard 8 A SCRs

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Manufacturer	STMICROELECTRONICS [STMicroelectronics]

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4 / 13 page

Characteristics

TN805, TN815, TS820, TYN608

4/13

Doc ID 7476 Rev 7

Figure 3.

Average and DC on-state current

versus ambient temperature

Figure 4.

Relative variation of thermal

impedance junction to case versus

pulse duration

I

(A)

T(AV)

0,0

0,5

1,0

1,5

2,0

2,5

0

25

50

75

100

125

DPAK

IPAK

TO-220AB

TO-220FPAB

T

(°C)

amb

D.C.

α = 180°

Recommended pad layout,

FR4 printed circuit board

1E-3

1E-2

1E-1

1E+0

0.1

0.2

0.5

1.0

K=[Z

/R

th(j-c)

th(j-c)]

t (s)

p

Figure 5.

Relative variation of thermal

impedance junction to ambient

versus pulse duration

Figure 6.

Relative variation of gate trigger

current and holding current versus

junction temperature for TS820

1E-2

1E-1

1E+0

1E+1

1E+2

5E+2

0.01

0.10

1.00

K=[Z

/R

th(j-a)

th(j-a)]

t (s)

p

DPAK

TO-220AB / IPAK

TO-220FPAB

Recommended pad layout,

FR4 printed circuit board

-40

-20

0

40

20

60

80

100

120

140

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

T (°C)

j

I,I ,I [T ] /

GTHL

j

I

,I ,I [T =25°C]

GTHL

j

IGT

IH & I

R

= 1k

L

GK

Ω

Figure 7.

Relative variation of gate trigger

and holding current versus junction

temperature

Figure 8.

Relative variation of holding

current versus gate-cathode

resistance (typical values)

-40

-20

0

20

40

60

80

100

120

140

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

2.2

2.4

T (°C)

j

I,I ,I [T ] /

GTHL

j

I

,I ,I [T =25°C]

GTHL

j

IGT

IH & IL

TN8 and TYNx8

1E-2

1E-1

1E+0

1E+1

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

5.5

6.0

R(k )

GK

Ω

I [R

] / I [

=1k ]

HGK

H

Ω

RGK

Tj = 25°C

TS8

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