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H5PS1G63JFRE3C Datasheet(PDF) 9 Page - Hynix Semiconductor |
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H5PS1G63JFRE3C Datasheet(HTML) 9 Page - Hynix Semiconductor |
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9 / 62 page  Rev. 1.7 / Nov. 2011 9 Release H5PS1G63JFR Series 2. Maximum DC Ratings 2.1 Absolute Maximum DC Ratings Note: 1. Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rat- ing conditions for extended periods may affect reliability. 2. Storage Temperature is the case surface temperature on the center/top side of the DRAM. For the measurement conditions. please refer to JESD51-2 standard. 2.2 DRAM Component Operating Temperature Range Symbol Parameter Rating Units Notes VDD Voltage on VDD pin relative to Vss - 1.0 V ~ 2.3 V V 1 VDDQ Voltage on VDDQ pin relative to Vss - 0.5 V ~ 2.3 V V 1 VDDL Voltage on VDDL pin relative to Vss - 0.5 V ~ 2.3 V V 1 VIN, VOUT Voltage on any pin relative to Vss - 0.5 V ~ 2.3 V V 1 TSTG Storage Temperature -55 to +100 C 1, 2 II Input leakage current; any input 0V VIN VDD; all other balls not under test = 0V) -2 uA ~ 2 uA uA IOZ Output leakage current; 0V VOUT VDDQ; DQ and ODT disabled -5 uA ~ 5 uA uA Temperature Range Symbol Parameter Rating Units Notes TOPER Normal Operating Temperature Range 0 to 85 o C 1,2 Industrial Temperature Range -40 to 95 o C1,3 Notes: 1. Operating Temperature TOPER is the case surface temperature on the center / top side of the DRAM. For measure- ment conditions, please refer to the JEDEC document JESD51-2. 2. The Normal Temperature Range specifies the temperatures where all DRAM specifications will be supported. Dur- ing operation, the DRAM case temperature must be maintained between 0 - 85oC under all operating conditions. 3. Some applications require operation of the DRAM in the Extended Temperature Range between 85oC and 95oC case temperature. Full specifications are guaranteed in this range, but the following additional conditions apply: a. Refresh commands must be doubled in frequency, therefore reducing the Refresh interval tREFI to 3.9 µs. b. If Self-Refresh operation is required in the Extended Temperature Range, then it is mandatory to use the Man- ual Self-Refresh mode with Extended Temperature Range capability (MR2 A6 = 0b and MR2 A7 = 1b). |
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