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MHST02555 Datasheet(PDF) 5 Page - General Semiconductor |
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MHST02555 Datasheet(HTML) 5 Page - General Semiconductor |
5 / 8 page Tyco Electronics Corp. 5 Technical Note July 1996 250 W—300 W Board-Mounted Power Modules Thermal Management for FC- and FW-Series Module Derating (continued) Heat Sink Configuration (continued) 8-1317 Figure 7. Heat Sinks with Transverse Fins Nomenclature for this family of heat sinks is as follows: MHSxyyy55 where: x = fin orientation; longitudinal (L) or transverse (T) yyy = heat sink height (in 100ths of inch) For example, MHST10055 is a heat sink that is transverse mounted (see Figure 7) for a 4.6 in. x 2.4 in. module with a heat sink height of 1 in. The “M” prefix represents a heat sink kit with metric hardware. 1/4 IN. (MHST02555) 1/2 IN. (MHST05065) 1 IN. (MHST10055) 1 1/2 IN. (MHST15055) 2.36 4.56 |
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