R08DS0074EJ0300 Rev.3.00

Page 10 of 12

Jan 9, 2013

NOTES ON HANDLING

1. Recommended soldering conditions

(1) Infrared reflow soldering

•

Peak reflow temperature

260

°C or below (package surface temperature)

•

Time of peak reflow temperature

10 seconds or less

•

Time of temperature higher than 220

°C

60 seconds or less

•

Time to preheat temperature from 120 to 180

°C

120

±30 s

•

Number of reflows

Three

•

Flux

Rosin flux containing small amount of chlorine (The flux

with a maximum chlorine content of 0.2 Wt% is

recommended.)

120±30 s

(preheating)

220

°C

180

°C

Time (s)

Recommended Temperature Profile of Infrared Reflow

(heating)

to 10 s

to 60 s

260

°C MAX.

120

°C

(2) Wave soldering

•

Temperature

260

°C or below (molten solder temperature)

•

Time

10 seconds or less

•

Preheating conditions

120

°C or below (package surface temperature)

•

Number of times

One (Allowed to be dipped in solder including plastic mold portion.)

•

Flux

Rosin flux containing small amount of chlorine (The flux with a maximum chlorine

content of 0.2 Wt% is recommended.)

(3) Soldering by Soldering Iron

•

Peak Temperature (lead part temperature) 350

°C or below

•

Time (each pins)

3 seconds or less

•

Flux

Rosin flux containing small amount of chlorine (The flux with a

maximum chlorine content of 0.2 Wt% is recommended.)

(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead

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