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ADP2121 Datasheet(PDF) 4 Page - Analog Devices |
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ADP2121 Datasheet(HTML) 4 Page - Analog Devices |
4 / 20 page ADP2121 Rev. B | Page 4 of 20 ABSOLUTE MAXIMUM RATINGS Table 3. Parameter Rating VIN to GND −0.3 V to +6 V EN, MODE to GND −0.3 V to VIN FB, SW to GND −0.3 V to VIN + 0.2 V Operating Ambient Temperature Range (I LOAD ≤ 600 mA) –40°C to +85°C Operating Junction Temperature Range –40°C to + 125°C Storage Temperature –45°C to +150°C Soldering Conditions JEDEC J-STD-020 ESD (Electrostatic Discharge) Human Body Model ±4 kV Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL DATA Absolute maximum ratings apply individually only, not in combination. The ADP2121 can be damaged when the junction temperature limits are exceeded. Monitoring ambient tempera- ture does not guarantee that the junction temperature (TJ) is within the specified temperature limits. In applications with high power dissipation and poor PCB thermal resistance, the maximum ambient temperature may need to be derated. In applications with moderate power dissipation and low PCB thermal resistance, the maximum ambient temperature can exceed the maximum limit as long as the junction temperature is within specification limits. The junction temperature (TJ) of the device is dependent on the ambient temperature (TA), the power dissipation of the device (PD), and the junction-to-ambient thermal resistance of the package (θJA). Maximum junction temperature (TJ) is calculated from the ambient temperature (TA) and power dissipation (PD) using the following formula: TJ = TA + (PD × θJA) The junction-to-ambient thermal resistance (θJA) of the package is based on modeling and calculation using a 2- and 4-layer board. The junction-to-ambient thermal resistance is highly dependent on the application and board layout. In applications where high maximum power dissipation exists, close attention to thermal board design is required. The value of θJA may vary, depending on PCB material, layout, and environmental conditions. Refer to JEDEC JESD51-9 for detailed information about board construction. THERMAL RESISTANCE The junction-to-ambient thermal resistance of the system (θJA) is specified for worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 4. Package Type θ JA Unit 6-Ball WLCSP 2-Layer Board 198 °C/W 4-Layer Board 105 °C/W ESD CAUTION |
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