ADP2121 datasheet(4/20 Pages) AD

Part #	ADP2121

Description	600 mA, 6 MHz, Synchronous Step-Down DC-to-DC Converter

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Manufacturer	AD [Analog Devices]

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ADP2121

Rev. B | Page 4 of 20

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

VIN to GND

−0.3 V to +6 V

EN, MODE to GND

−0.3 V to VIN

FB, SW to GND

−0.3 V to VIN + 0.2 V

Operating Ambient Temperature Range

(I

LOAD ≤ 600 mA)

–40°C to +85°C

Operating Junction Temperature Range

–40°C to + 125°C

Storage Temperature

–45°C to +150°C

Soldering Conditions

JEDEC J-STD-020

ESD (Electrostatic Discharge)

Human Body Model

±4 kV

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL DATA

Absolute maximum ratings apply individually only, not in

combination. The ADP2121 can be damaged when the junction

temperature limits are exceeded. Monitoring ambient tempera-

ture does not guarantee that the junction temperature (TJ) is

within the specified temperature limits. In applications with

high power dissipation and poor PCB thermal resistance, the

maximum ambient temperature may need to be derated. In

applications with moderate power dissipation and low PCB

thermal resistance, the maximum ambient temperature can

exceed the maximum limit as long as the junction temperature

is within specification limits.

The junction temperature (TJ) of the device is dependent on the

ambient temperature (TA), the power dissipation of the device

(PD), and the junction-to-ambient thermal resistance of the

package (θJA). Maximum junction temperature (TJ) is calculated

from the ambient temperature (TA) and power dissipation (PD)

using the following formula:

TJ = TA + (PD × θJA)

The junction-to-ambient thermal resistance (θJA) of the package

is based on modeling and calculation using a 2- and 4-layer

board. The junction-to-ambient thermal resistance is highly

dependent on the application and board layout. In applications

where high maximum power dissipation exists, close attention

to thermal board design is required.

The value of θJA may vary, depending on PCB material, layout,

and environmental conditions. Refer to JEDEC JESD51-9 for

detailed information about board construction.

THERMAL RESISTANCE

The junction-to-ambient thermal resistance of the system (θJA)

is specified for worst-case conditions, that is, a device soldered

in a circuit board for surface-mount packages.

Table 4.

Package Type

θ

JA

Unit

6-Ball WLCSP

2-Layer Board

198

°C/W

4-Layer Board

105

°C/W

ESD CAUTION

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