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HMT351S6EFR8C-RD Datasheet(PDF) 11 Page - Hynix Semiconductor |
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HMT351S6EFR8C-RD Datasheet(HTML) 11 Page - Hynix Semiconductor |
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11 / 50 page  Rev.1.3 /Sep. 2013 11 Absolute Maximum Ratings Absolute Maximum DC Ratings Notes: 1. Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rat- ing conditions for extended periods may affect reliability. 2. Storage Temperature is the case surface temperature on the center/top side of the DRAM. For the measurement conditions, please refer to JESD51-2 standard. 3. VDD and VDDQ must be within 300mV of each other at all times; and VREF must not be greater than 0.6XVDDQ,When VDD and VDDQ are less than 500mV; VREF may be equal to or less than 300mV. DRAM Component Operating Temperature Range Notes: 1. Operating Temperature TOPER is the case surface temperature on the center / top side of the DRAM. For mea- surement conditions, please refer to the JEDEC document JESD51-2. 2. The Normal Temperature Range specifies the temperatures where all DRAM specifications will be supported. Dur- ing operation, the DRAM case temperature must be maintained between 0 - 85oC under all operating conditions. 3. Some applications require operation of the DRAM in the Extended Temperature Range between 85oC and 95oC case temperature. Full specifications are guaranteed in this range, but the following additional conditions apply: a. Refresh commands must be doubled in frequency, therefore reducing the Refresh interval tREFI to 3.9 µs. It is also possible to specify a component with 1X refresh (tREFI to 7.8µs) in the Extended Temperature Range. Please refer to the DIMM SPD for option availability b. If Self-Refresh operation is required in the Extended Temperature Range, then it is mandatory to use the Manual Self-Refresh mode with Extended Temperature Range capability (MR2 A6 = 0b and MR2 A7 = 1b). DDR3 SDRAMs support Extended Temperature Range and please refer to component datasheet and/or the DIMM SPD for tFEFI requirements in the Extended Temperature Range. Absolute Maximum DC Ratings Symbol Parameter Rating Units Notes VDD Voltage on VDD pin relative to Vss - 0.4 V ~ 1.8 V V 1,3 VDDQ Voltage on VDDQ pin relative to Vss - 0.4 V ~ 1.8 V V 1,3 VIN, VOUT Voltage on any pin relative to Vss - 0.4 V ~ 1.8 V V 1 TSTG Storage Temperature -55 to +100 oC1, 2 Temperature Range Symbol Parameter Rating Units Notes TOPER Normal Operating Temperature Range 0 to 85 oC 1,2 Extended Temperature Range 85 to 95 oC1,3 |
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