MOS FET Relays

Technical Information

3

■ Protection from Spike Voltage on the

Output Terminals

If a spike voltage exceeding the absolute maximum rated value is

generated between the output terminals, insert a C-R snubber or

clamping diode in parallel to the load as shown in the following circuit

diagram to limit the spike voltage.

Spike Voltage Protection Circuit Example

■ Unused Terminals (6-pin models only)

Terminal 3 is connected to the internal circuit. Do not connect any-

thing to terminal 3 externally.

■ Pin Strength for Automatic Mounting

In order to maintain the characteristics of the relay, the force imposed

on any pin of the relay for automatic mounting must not exceed the

following.

In direction A: 1.96 N

In direction B: 1.96 N

■ Load Connection

Do not short-circuit the input and output terminals while the relay is

operating or the relay may malfunction.

Guidelines for Mounting Devices on PCBs

■ Cleaning

When ions in the flux enter into the product during soldering, fluctua-

tion in device performance or corrosion may occur. Be sure to wash

away any flux residue which contains Cl or Na ions.

The following types of solvents are recommended for cleaning the

flux:

• Asahi Clean AK-225AES

• Kao Cleanthru 750H

• Pine-Alpha ST-100S

Cleaning Conditions

Cleaning conditions and precautions may vary according to product

specifications.

General precautions for dip cleaning

Dipping time varies according to the solvent used.

However, as a general guideline, it is recommended that the dip

time be limited to three minutes.

General precautions for ultrasonic cleaning

When ultrasonic cleaning is conducted for an excessively long

time, contact between the product resin and the metal leads may

lessen. Also, excessive ultrasonic stress may cause cracks in the

pellet.

It is recommended that the applied stress be minimized.

Recommended conditions for standard ultrasonic cleaning

Frequency:

27kHz to 29kHz

Output:

Time:

30 seconds or less

Temperature: 50

°C (may vary according to the type of solvent used)

Cleaning must be conducted with the printed circuit board or device

floating on the solvent, so as to avoid direct contact between the PCB

or device and the ultrasonic vibrator.

Handling Precautions

Do not touch the device’s mark-bearing surface with your hand or

with a brush while cleaning or applying cleaning liquid to the device.

This may erase device markings. It is important to confirm that nei-

ther the solvent used for cleaning nor the cleaning conditions will

damage the device package.

+

−

1

2

3

6

5

4

AC

+

−

+

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DC

DC

Or:

Or:

Load

Load

Load

+

−

1

2

3

6

5

4

+

−

DC

+

−

1

2

3

6

5

4

+

−

DC

+

−

1

2

3

6

5

4

+

−

DC

Load

AC Connection

DC Single Connection

DC Parallel Connection