Technical Data Sheet

5484BN/BADC-AGJA/X/MS

Everlight Electronics Co., Ltd.

http\\:www.everlight.com

Rev 1

Page: 7 of 9

Device Number : DLE-0001237

Prepared date:04-15-2009

Prepared by: Grace Shen

Prehead

laminar wave

Fluxing

Recommended soldering conditions:

Hand Soldering

DIP Soldering

Temp. at tip of iron

300

Max.

℃

(30W

Max.)

Preheat temp.

100

Max.

℃

(60 sec

Max.)

Soldering time

3 sec Max.

Bath temp. & time

260 Max., 5 sec Max

Distance

3mm Min.(From

solder joint to

epoxy bulb)

Distance

3mm

Min.

(From

solder joint to epoxy

bulb)

Recommended soldering profile

Avoiding applying any stress to the lead frame while the LEDs are at high temperature

particularly when soldering.

Dip and hand soldering should not be done more than one time

After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or

vibration until the LEDs return to room temperature.

A rapid-rate process is not recommended for cooling the LEDs down from the peak

temperature.