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EXC28BA221U Datasheet(PDF) 3 Page - Panasonic Semiconductor |
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EXC28BA221U Datasheet(HTML) 3 Page - Panasonic Semiconductor |
3 / 4 page Chip Bead Array Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 87 6 5 12 3 4 87 6 5 12 3 4 t1 t2 D0 P1 P2 P0 A f Chip component Sprocket hole Compartment Tape running direction E T W fD fC fA ● Taping Reel ● Embossed Carrier Taping Standard Reel Dimensions (mm) Embossed Carrier Dimensions (mm) Part Number Kind of Taping Pitch (P 1)Quantity EXC28B □□□□U Embossed Carrier Taping 4 mm 5000 pcs./reel ■ Packaging Methods (Taping) ● Standard Quantity Part Number A B W F E P 1 P 2 P 0 0D 0 t 1 t 2 EXC28B □□□□U 1.20±0.15 2.25±0.15 8.0±0.2 3.5±0.1 1.75±0.10 4.0±0.1 2.0±0.1 4.0±0.1 1.5±0.1 0.25±0.05 0.90±0.15 Part Number 0A 0B 0C 0DE W T EXC28B □□□□U 180–3.0 60.0±1.0 13.0±0.5 21.0±0.8 2.0±0.5 9.0±0.3 11.4±1.5 0 ■ Circuit Configuration(No Polarity) Nov. 2012 02 41 |
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