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CHA6252-QFG Datasheet(PDF) 3 Page - United Monolithic Semiconductors

Part # CHA6252-QFG
Description  13-15.5GHz Power Amplifier
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Manufacturer  UMS [United Monolithic Semiconductors]
Direct Link  http://www.ums-gaas.com
Logo UMS - United Monolithic Semiconductors

CHA6252-QFG Datasheet(HTML) 3 Page - United Monolithic Semiconductors

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13-15.5GHz Power Amplifier
CHA6252-QFG
Ref. : DSCHA6252-QFG2355 - 20 Dec 12
3/12
Specifications subject to change without notice
Bat. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France
Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34
Device thermal performances
All the figures given in this section are obtained assuming that the QFN device is cooled
down only by conduction through the package thermal pad (no convection mode considered).
The temperature is monitored at the package back-side interface (Tcase) as shown below.
The system maximum temperature must be adjusted in order to guarantee that Tcase
remains below the maximum value specified in the next table. So, the system PCB must be
designed to comply with this requirement.
A derating must be applied on the dissipated power if the Tcase temperature cannot be
maintained below the maximum temperature specified (see the curve Pdiss. Max) in order to
guarantee the nominal device life time (MTTF).
Recommended max. junction temperature (Tj max)
:
152 °C
Junction temperature absolute maximum rating
:
175 °C
Max. continuous dissipated power (Pdiss. Max.)
:
7.7 W
=> Pdiss. Max. derating above Tcase
(1)= 85
°C :
115 mW/°C
Junction-Case thermal resistance (Rth J-C)
(2)
:
<8 °C/W
Minimum Tcase operating temperature
(3)
:
-40 °C
Maximum Tcase operating temperature
(3)
:
85 °C
Minimum storage temperature
:
-55 °C
Maximum storage temperature
:
150 °C
(1) Derating at junctio n temperature co nstant = Tj max.
(2) Rth J-C is calculated fo r a wo rst case co nsidering the ho t t e s t junc t io n
o f the M M IC and all the devices biased.
(3) Tcase=P ackage back side temperature measured under the die-attach-pad (see the drawing belo w).
6.4
DEVICE THERMAL SPECIFICATION : CHA6252-QFG
0
1
2
3
4
5
6
7
8
9
-50
-25
0
25
50
75
100
125
150
175
Tcase (°C)
Pdiss. Max. @Tj <Tj max (W)
Tcase
Example: QFN 16L 3x3
Location of temperature
reference point (Tcase)
on package's bottom side


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